KAOHSIUNG, Sept. 2, 2024
/PRNewswire/ -- E&R Engineering Corp. (8027.TWO) hosted an
event on August 28, 2024, in
Taipei, Taiwan, where they
launched the "E-Core System." This initiative, a combination of
"E&R" and "Glass Core" inspired by the sound of "Ecosystem,"
led to the establishment of the "Glass Substrate Supplier E-Core
System Alliance." The alliance aims to combine expertise to promote
comprehensive solutions, providing equipment and materials for
next-generation advanced packaging with glass substrates to both
domestic and international customers.
E&R's E-Core Alliance includes Manz AG, Scientech for wet
etching, ShyaWei Optronics for AOI optical inspection,
Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF
lamination equipment, and other key component suppliers such as
HIWIN, HIWIN Mikrosystem, Keyence Taiwan, Mirle Group, ACE PILLAR, CHD TECH, and Coherent.
E&R will continue leading the development of glass substrate
technology in Taiwan, optimizing
processes, and collaborating with more industry partners to achieve
excellence.
With the rapid growth in demand for AI chips, high-frequency,
and high-speed communication devices, glass substrates in advanced
packaging technologies are becoming increasingly important.
Compared to the widespread use of copper foil substrates, glass
substrates offer higher wiring density and better signal
performance. Additionally, glass provides high flatness and can
withstand high temperatures and voltages, making it an ideal
replacement for traditional substrates.
The glass substrate process involves glass metallization, ABF
(Ajinomoto Build-up Film) lamination, and final substrate cutting.
Key steps in glass metallization include TGV (Through-Glass Via),
wet etching, AOI (Automated Optical Inspection), sputtering, and
plating. These substrates measure 515×510mm, representing a new
process in semiconductor and substrate manufacturing.
The critical aspect of glass substrate technology is the first
step—glass laser modification (TGV). Although introduced over a
decade ago, its speed had not met mass production requirements,
achieving only 10 to 50 vias per second, limiting the market impact
of glass substrates. E&R Engineering Corp. (8027.TWO) has
been working with a North American IDM customer for the past five
years to develop glass laser modification TGV technology. Last
year, the process passed validation, with E&R mastering key
technology, now achieving up to 8,000 vias per second for fixed
patterns (matrix layout) or 600 to 1,000 vias per second for
customized patterns (random layout), with an accuracy of +/- 5 μm,
meeting the 3 sigma standard. This breakthrough has finally enabled
glass substrates to reach mass production.
E&R will also showcase the latest technologies at SEMICON
Taiwan 2024 and SEMICON Europa 2024.
SEMICON Taiwan 2024
- Location: Taipei Nangang Exhibition Center Hall 1
- Booth Information: 4F, #N0968
- Date: September 4-6, 2024
SEMICON Europa 2024
- Location: Messe München
- Booth Information:C2622
- Date: November 12-15, 2024
https://www.enr.com.tw/
Photo - https://mma.prnewswire.com/media/2493137/1.jpg
Photo -
https://mma.prnewswire.com/media/2493135/E_R_possesses_key_self_developed_technology_the_TGV__Through_Glass_Via__Glass_Core.jpg
Photo -
https://mma.prnewswire.com/media/2493136/E_R_mastered_key_technology_achieving_8_000_vias_matrix_layouts.jpg
View original
content:https://www.prnewswire.co.uk/news-releases/er-engineering-corp-forms-e-core-system-alliance-leading-glass-substrate-into-the-mass-production-era-302235685.html