BOSTON, April 16, 2024 /PRNewswire/ -- The move
towards 800V and above in electric vehicles is already well
underway, spearheaded by numerous automotive OEMs such as GM,
Hyundai, VW, and Lucid Motors. These platforms enhance efficiency
by minimizing joule losses and allowing for the downsizing of
high-voltage cabling, thus reducing weight. This transition is
facilitated by advancements in technologies and materials,
particularly silicon carbide (SiC) MOSFETs, thanks to their
improved ability to support high-frequency switching at higher
voltages. In comparison to Si IGBTs, SiC MOSFETs offer smaller die
areas and higher junction temperatures, necessitating more
effective thermal management.
Addressing this challenge, IDTechEx has noted various emerging
thermal management strategies, ranging from altering thermal
architecture to utilizing different die-attach materials and
thermal interface materials (TIM). This shift is anticipated to
present significant opportunities in the thermal management market,
propelling the annual market value of TIMs to surpass US$900 million by 2034. In its latest research
titled "Thermal Management for EV Power Electronics 2024-2034:
Forecasts, Technologies, Markets, and Trends", IDTechEx conducted a
comprehensive analysis of the market prospects for different TIMs
concerning Si IGBT, SiC MOSFET, and GaN HEMT inverters while
identifying potential market drivers.
High-performance TIMs
Thermal interface materials (TIMs) are commonly applied between
the baseplate and the heatsink. IDTechEx anticipates a surge in
demand for TIM with higher thermal conductivity (TC) owing to the
escalating heat flux of SiC MOSFETs. As of 2024, the typical TC of
this TIM ranges from 2.5 to 3W/mK, with expectations for this to
exceed 5 or 6W/mK in some cases by 2034. This will correspond to a
proportional rise in unit price alongside an increase in the market
value of TIM. Although heightened production volumes might lead to
a reduction in the average cost of TIM, IDTechEx suggests that the
increase in average TC will outpace any manufacturing improvements,
given the already large manufacturing capacity of TIM2 materials in
2024.
An interesting example of a higher-performance TIM2 material is
Honeywell's PTM7000, boasting a TC of 6.5W/mK, which has already
been utilized in onsemi's VE-Trac family. IDTechEx's latest
research, "Thermal Management for EV Power Electronics 2024-2034:
Forecasts, Technologies, Markets, and Trends", provides a
comprehensive overview of properties such as TC, density, etc., of
TIMs used in EV power electronics.
Die-attach and substrate-attach materials
Conventional die-attach and substrate-attach materials typically
consist of solder alloys featuring bondline thicknesses ranging
from 50 to 100µm for die-attach and 100 to 150µm for
substrate-attach materials. Despite their satisfactory performance,
IDTechEx has observed a growing preference for Ag sintering, led by
major automotive OEMs such as Tesla, BYD, and Hyundai. Ag
sintering, in comparison to traditional solder alloys, offers
superior thermal and electrical conductivity, enhanced bond
strength, and various other benefits. However, due to its higher
costs and processing times, Ag sintering is likely to see primary
adoption in applications that really require its benefits, such as
wide bandgap-based inverters.
The cost of Ag sintering can vary significantly based on factors
like customer relationships, order volumes, and suppliers. IDTechEx
suggests that the cost of Ag sintered paste can easily be five to
ten times higher than that of solder alloys. For instance, IDTechEx
learned of an Ag sintered paste developed by a Japanese company
costing around US$2/g, though this
price has the potential to decrease significantly with increased
volume. Overall, driven by leading automotive players, there is a
discernible trend toward replacing solder alloys with Ag sintering
pastes, creating market opportunities for material suppliers.
To address the cost factor, Cu sintering is proposed as an
alternative approach. Compared to Ag sintering, Cu sintering aims
to offer similar performance at a lower cost. A supplier informed
IDTechEx that Cu sinter can cost as little as half as much as Ag
sinter. However, as of 2024, IDTechEx has not observed widespread
commercialization of Cu sintering technology in EV power modules.
Due to limited volume and technical challenges, the cost of Cu
sintering currently often surpasses that of Ag sintering. The
IDTechEx report, "Thermal Management for EV Power Electronics
2024-2034: Forecasts, Technologies, Markets, and Trends", provides
a comprehensive overview of the market opportunities in Ag and Cu
sintering technologies, highlights the competitive landscape and
supply chain, and analyzes the key players in the substrate-attach
and die-attach sectors.
To find out more about this report, including downloadable
sample pages, please visit www.IDTechEx.com/TMPE.
For the full portfolio of electric vehicle market research from
IDTechEx, please visit www.IDTechEx.com/Research/EV.
Upcoming free-to-attend webinar
Advanced Thermal
Management in EV Power Electronics: Thermal Materials and Thermal
Architecture Trends
Yulin Wang, Senior Technology
Analyst at IDTechEx and author of this article, will be presenting
a free-to-attend webinar on the topic on Wednesday 8 May 2024 - Advanced Thermal Management in EV
Power Electronics: Thermal Materials and Thermal Architecture
Trends.
With the migration from Si IGBT to SiC MOSFET led by leading
automotive OEMs like VW, Tesla, Hyundai, and BYD, IDTechEx has
observed a rise in junction temperature, potentially surpassing
200°C. This presents unprecedented thermal challenges for
conventional thermal management solutions. To address these
challenges and mitigate overheating issues, leading semiconductor
suppliers, tier one suppliers, and automotive OEMs have proposed
various strategies. These include transitioning to direct liquid
cooling employing a pin-fin structure, using double-sided cooling,
replacing solder alloys with silver or copper sintered paste,
employing thermal interface materials with high thermal
conductivity, and replacing aluminum wire bonds with copper
alternatives.
In this webinar, IDTechEx will conduct an analysis of the
traditional thermal structure of power modules and identify the
trends and changes in thermal structure and materials employed.
The webinar encompasses the following insights:
- A high-level examination of the conventional thermal framework
in EV power electronics alongside projections for future
structures
- Analysis of trends of die-attach and substrate-attach
materials
- Trends in Thermal Interface Materials (TIM) and an assessment
of commercially available TIMs tailored for power
electronics
- Comparison of single and double-sided cooling, alongside
emerging trends and commercial applications
Please click here to check timings and register for your
specific time zone.
If you are unable to make the date, please register anyway to
receive the links to the on-demand recording (available for a
limited time) and webinar slides as soon as they are available.
About IDTechEx:
IDTechEx provides trusted independent research on emerging
technologies and their markets. Since 1999, we have been
helping our clients to understand new technologies, their supply
chains, market requirements, opportunities and forecasts. For more
information, contact research@IDTechEx.com or
visit www.IDTechEx.com.
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