Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
09 July 2024 - 9:50AM
Business Wire
Collaboration with leading Japanese AI company
will produce cutting-edge AI accelerator chips
Samsung Electronics Co., Ltd., a world leader in advanced
semiconductor technology, today announced that it will provide
turnkey semiconductor solutions using the 2-nanometer (nm) foundry
process and the advanced 2.5D packaging technology Interposer-Cube
S (I-Cube S) to Preferred Networks, a leading Japanese AI
company.
By leveraging Samsung’s leading-edge foundry and advanced
packaging products, Preferred Networks aims to develop powerful AI
accelerators that meet the ever-growing demand for computing power
driven by generative AI.
Since starting mass production of the industry’s first 3nm
process node applying Gate-All-Around (GAA) transistor
architecture, Samsung has strengthened its GAA technology
leadership by successfully winning orders for the 2nm process with
further upgrades in performance and power efficiency.
The cooperation with Preferred Networks marks the first
achievement for Japanese companies in the field of large-sized
heterogeneous integrated package technologies and Samsung plans to
accelerate its leading global advanced package market
offensive.1
The 2.5D Advanced Package I-Cube S technology included in the
turnkey solutions, is a heterogeneous integration package
technology, with multiple chips in one package to enhance
inter-connection speed and reduce package size. The use of the
silicon interposer (Si-interposer) is crucial in achieving
ultra-fine redistribution layer (RDL) and stabilizing power
integrity for optimal semiconductor performance. GAONCHIPS, a
specialized system semiconductor development company, designed the
chip.
"We are excited to lead in AI accelerator technology with
Samsung Electronics’ 2nm GAA process. This solution will
significantly support Preferred Networks’ ongoing efforts to build
highly energy-efficient, high-performance computing hardware that
meets the ever-growing computing demands from generative AI
technologies, especially large language models.,” said Junichiro
Makino, VP and Chief Technology Officer (CTO) of Computing
Architecture at Preferred Networks.
"This order is pivotal as it validates Samsung's 2nm GAA process
technology and Advanced Package technology as an ideal solution for
next-generation AI accelerators," said Taejoong Song, Corporate VP
and the head of Foundry Business Development Team at Samsung
Electronics. "We are committed to closely collaborating with our
customers ensuring that the high performance and low power
characteristics of our products are fully realized."
Preferred Networks, headquartered in Tokyo, develops advanced
software and hardware technologies by vertically integrating the AI
value chain from chips to supercomputers and generative AI
foundation models. It provides solutions and products for various
industries such as manufacturing, transportation, healthcare,
entertainment, and education. The company is one of the major
players in the global AI market, achieving first place three times
in the past five years on the Green5002 list of supercomputers.
Based on this collaboration, Samsung and Preferred Networks plan
to showcase groundbreaking AI chiplet solutions for the
next-generation data center and generative AI computing market in
the future.3
About Samsung Electronics Co.,
Ltd.
Samsung inspires the world and shapes the future with
transformative ideas and technologies. The company is redefining
the worlds of TVs, smartphones, wearable devices, tablets, home
appliances, network systems, and memory, system LSI, foundry and
LED solutions, and delivering a seamless connected experience
through its SmartThings ecosystem and open collaboration with
partners. For the latest news, please visit the Samsung Newsroom at
news.samsung.com.
1 Heterogeneous integration packaging technology integrates
different types of chips - such as memory, logic, and sensors - in
a single package. 2 Green500: the ranking of the TOP500
supercomputers in the world based on their performance-per-watt
efficiency 3 Chiplet Solution: A technology of assembling into a
single package with other different chips performing different
fuctions through the packaging technologies
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version on businesswire.com: https://www.businesswire.com/news/home/20240709292190/en/
Ujeong Jahnke Samsung Semiconductor Europe GmbH Tel.
+49(0)89-45578-1000 Email: sseg.comm@samsung.com