Toshiba Corporation Expand Semiconductor Fabrication Facility (3707I)

TIDMTOS

RNS Number : 3707I

Toshiba Corporation

02 July 2013

July 2, 2013

Hisao Tanaka

President & CEO

Toshiba Corporation

1-1-1 Shibaura, Minato-ku, Tokyo, Japan

Contact: Naoto Hasegawa, General Manager

Corporate Communications Office

Tel: [phone]

This is to give notice that Toshiba Corporation announced the expansion of semiconductor fabrication facility as reported to Tokyo Stock Exchange today, July 2, 2013 .

At this time, Toshiba does not plan to revise projections for fiscal 2013 business performance due to this matter.

FOR IMMEDIATE RELEASE

July 2, 2013

Toshiba to Expand Semiconductor Fabrication Facility

- To start second phase construction of Fab 5 at Yokkaichi -

TOKYO - Toshiba Corporation (Tokyo: 6502) today announced that it will expand its state-of-art No. 5 semiconductor fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories. Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

Yokkaichi Operations currently has three Fabs mass producing NAND flash memory, including Fab 5 phase 1. Fab 5's construction was planned around two phases, the first of which went into operation in July 2011. After giving careful consideration to the balance of product supply and demand, and noting a recovery driven by growing demand for smartphones, tablets, SSD for enterprise servers and other new applications, Toshiba now anticipates further medium- to long-term market expansion and recognizes that the time is right to expand Fab 5.

In addition to securing capacity for future generations of NAND Flash memory fabricated with the company's latest process technology, Toshiba will also use Fab 5 phase 2 for production of 3D memories that are expected to find growing application in coming years. The extension will allow the company to boost competitiveness and enhance its responsiveness to technology advances and market demands.

Fab 5 phase 2 will have an automated product transportation system and quake-absorbing structure and will be designed to minimize environmental loads. Deployment of LED lighting and up-to-date energy-saving production facilities, along with full and effective use of waste heat, are expected to cut CO(2) emissions by 13% compared with Fab 4.

Going forward, Toshiba will expand its memory business and boost competitiveness by timely investments, leadership in advanced process technology and the development of new generation memories that answer market needs.

This information is provided by RNS

The company news service from the London Stock Exchange

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