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ENET Ethernity Networks Ltd

0.825
-0.025 (-2.94%)
Last Updated: 08:20:28
Delayed by 15 minutes
Share Name Share Symbol Market Type Share ISIN Share Description
Ethernity Networks Ltd LSE:ENET London Ordinary Share IL0011410359 ORD NIS0.001 (DI)
  Price Change % Change Share Price Bid Price Offer Price High Price Low Price Open Price Shares Traded Last Trade
  -0.025 -2.94% 0.825 0.80 0.85 0.85 0.825 0.85 5,559,928 08:20:28
Industry Sector Turnover Profit EPS - Basic PE Ratio Market Cap
Communications Equip, Nec 2.94M -8M -0.0212 -0.39 3.1M
Ethernity Networks Ltd is listed in the Communications Equip sector of the London Stock Exchange with ticker ENET. The last closing price for Ethernity Networks was 0.85p. Over the last year, Ethernity Networks shares have traded in a share price range of 0.225p to 6.75p.

Ethernity Networks currently has 377,642,243 shares in issue. The market capitalisation of Ethernity Networks is £3.10 million. Ethernity Networks has a price to earnings ratio (PE ratio) of -0.39.

Ethernity Networks Share Discussion Threads

Showing 43326 to 43343 of 43350 messages
Chat Pages: 1734  1733  1732  1731  1730  1729  1728  1727  1726  1725  1724  1723  Older
DateSubjectAuthorDiscuss
25/4/2024
15:47
Normal utter nonsense but enjoy yourself. It is quite simple. A new OEM or two might manufacture new PON solutions for BEAD. Nothing to do with European OEM which is wireless backhaul.
purchaseatthetop
25/4/2024
15:23
patt - "The US Telco has to supply products manufactured in the USA."

Yes in order to access BEAD funding. This was not always the case. ENET already has OEM agreements with a European OEM(s). Now it could be that their products were exported from Europe to the US, this they can no longer do so consequently have to set up new manufacturing agreements with US OEMs.

That's basically what the Business Update of 28/03/24 is about without ENET spelling out why they have had to do this.

Even more important that is the reason why all revenue as a result of BEAD related contracts have been predicted for H2 because they had no US OEM for H1.

pwhite73
25/4/2024
14:37
Utter nonsense Pwhite. The US Telco has to supply products manufactured in the USA. So Nokia do a deal with Samnina to manufacture in the USA. Much like Tarana make nothing themselves. They contract Flex in Mexico to do that. Frankly I have no idea what you are trying to prove. ENET will be working with whoever the OEM is to have the OLT/ONT units manufactured in the USA. Might even be Nokia.

Samnina are just like Flex but US manufacturing


"Sanmina’s engineers are highly experienced in integrating multiple complex technologies including electronics, fluidics and motion control into complete systems. A wide range of complex high-level assemblies including communications systems, power inverters, industrial control systems, semi-conductor systems, ATM machines, blood analyzers, MRI machines, commercial digital printers, multimedia kiosks and smart vending machines are manufactured by Sanmina. We also design manufacturing automation for medical and automotive applications where volumes are high and regulatory compliance is required. Our ability to combine management of third party component suppliers with in-house manufacturing of components and sub-assemblies and integrate them in high-level assemblies simplifies the supply chain for customers."

purchaseatthetop
25/4/2024
12:47
patt - "The OEMs manufacture in the USA using solutions designed by Ethernity."

No different from Nokia. Now Nokia have openly stated they are working with Sanmina to comply with the NTIA restrictions. Who are ENET working with?

What's changed is that the US Telco could have imported ENET products from the European manufacturer who ENET already have a contract with, they can't any longer. ENET needs a US OEM of its own if their products are to be eligible for BEAD funding.

pwhite73
25/4/2024
12:27
To qualify for BEAD they must abide by the rules. Which are:

2. Manufactured Products
a. Electronics
Electronics are likely to be the second largest segment of equipment used in BEAD fiber broadband deployments. Such electronics include, but are not limited to, Optical Network Terminals and Optical Network Units (ONTs/ONUs), Optical Line Terminals (OLTs) and remote Optical Line Terminals (rOLTs), OLT line cards, optic pluggables, routers, switches, optical amplifiers, and power systems. These electronics – and comparable electronics used in fixed wireless and other types of broadband network deployments, as well as antenna and antenna arrays – are almost uniformly manufactured in Southeast Asia. As part of its supply
chain research, DOC explored with manufacturers the possibility of moving the manufacturing of certain electronics to the United States to facilitate implementation of the Buy America
Preference. During DOC’s industry assessment, two key factors became apparent:
• Semiconductors, also referred to as integrated circuits, including systems on a chip, memory, central processing units, and others are key components of essentially all electronics that are used to build broadband networks. Semiconductors represent the majority of the value of the components that make up such products – often in excess of 70 percent. Almost all of these chips are currently manufactured outside the United States. While the historic CHIPS and Science Act, Pub. L. 117-167, 136 Stat. 1366, is expected to spur a major investment in domestic semiconductor manufacturing, the construction timeline and type of semiconductor fabrication plants mean that the impact of that investment is unlikely to be realized during the time period needed for the BEAD Program.
9

• There are some classes and categories of electronics that are currently manufactured outside of the United States, but for which there is an economic case for onshoring final assembly.
DOC therefore proposes, as discussed in section IV.B.1.b.ii below, to waive the Buy America Preference for all electronics in BEAD Program projects, with the exception of four categories of electronics. For the four categories of electronics listed in section IV.B.1.b, NTIA proposes to waive only the 55 percent cost of components test and to provide specific guidance regarding the manufacturing processes that must occur in the United States for the waiver to be applicable.

Those are the rules. And they help ENET because it is the four categories that are not waived: Optical Network Terminals and Optical Network Units (ONTs/ONUs), Optical Line Terminals (OLTs) and remote Optical Line Terminals (rOLTs), are what the OEMs are going to licence from us. The OEMs manufacture in the USA using solutions designed by Ethernity.

purchaseatthetop
25/4/2024
12:19
patt - " has signed a contract with a global wireless OEM based in Europe to supply its ENET 4840 40Gbps FPGA System-on-Chip (SoC) with support for Carrier Ethernet Switching, Wireless Bonding, and IPSec security. The ENET 4840 is a customised version of the device that is used within the UEP-20 Universal Edge Platform product design, which will also be supplied to the OEM for manufacturing.'"

To qualify for BEAD funding the US Telco must use electronic devices manufactured in the US and not simply import an ENET device from Israel or a European OEM.

This is why Nokia a European OEM has been forced to source the production of their electronic devices to a US OEM.

As of today I am not aware ENET has any manufacturing contracts with any US OEMs are you?

Speak Later

pwhite73
25/4/2024
11:50
PATT gone into overdrive, desperate for validation
orkneyarab
25/4/2024
11:46
The 12/10/21 RNS which was delayed and finally completed in Q1 24 illustrates the point very well:

'12 October 2021

ETHERNITY NETWORKS LIMITED

("Ethernity" or the "Company")

Ethernity Networks Receives New ~$400,000 Order for Customised FPGA SoC

Ethernity Networks (AIM: ENET.L), a leading supplier of data processing offload solutions on programmable FPGA (field programmable gate array) for accelerating telco/cloud networks, announces today that it has signed a contract with a global wireless OEM based in Europe to supply its ENET 4840 40Gbps FPGA System-on-Chip (SoC) with support for Carrier Ethernet Switching, Wireless Bonding, and IPSec security. The ENET 4840 is a customised version of the device that is used within the UEP-20 Universal Edge Platform product design, which will also be supplied to the OEM for manufacturing.'

We develop an R@D single example of the product. That is then customised for OEMs individual needs. The OEM then manufactures everything. We may supply the system on a chip like we do for Tarana but it is only a single FPGA loaded with code.

Here the customer is buying a special SoC and also the design of the UEP product that the SoC makes function.

purchaseatthetop
25/4/2024
11:17
PWhite7325 Apr '24 - 10:27 - 35314 of 35319
0 0 0
patt - I'm not getting involved in a circular argument with you. ENET offers solutions and products.





If ENET manufacture nothing then who manufactures and assembles their products on their products page. This is the final time I will ask this question.


Answer….the OEMs integrate our products snd solutions into their own White Label products. You will never see made by Ethernity on anything. Those items are R@D end products. Not for sale.

purchaseatthetop
25/4/2024
11:01
I wonder if we will see another
pump here, easy money when it
happens.

blue square
25/4/2024
11:00
The only relevant indicator on any debate is the share price. PWhite is winning by a country mile
orkneyarab
25/4/2024
10:56
To some extent I am seeing both sides of the debate and I cannot help at the moment as regards involvements with vendors and BEAD funding. I have never really researched the intracesies that you both offer.
I am happy at this stage to read your thoughts and wait for ENET RNSs.
I have a more pressing problem with my stand alone computer and the Internet but not my phone.

snooker40
25/4/2024
10:53
For the rest of you in summary this is what is going on.

ENET manufacture their own products and the products provide FWA and ngFWA solutions. Whilst certain items are exempt from NTIA restrictions like chips and processors as some 70% of these are manufactured in Southeast Asia whole products like routers, OLTs and ONTs are not this is why Nokia has outsourced its products to US manufacturer Sanmina.

ENET products are outside of the BEAD funding eligibility unless manufactured in the US. Once again this is what the RNS 28/03/24 is about, they need a US OEM for their products or its curtains.

pwhite73
25/4/2024
10:27
patt - I'm not getting involved in a circular argument with you. ENET offers solutions and products.





If ENET manufacture nothing then who manufactures and assembles their products on their products page. This is the final time I will ask this question.

pwhite73
25/4/2024
10:21
Pwhite. Ethernity manufacture nothing. They are solutions they offer
purchaseatthetop
25/4/2024
10:21
The next announcement here will be a placing..then after that.. another placing..then after that.. one final placing to pay the final creditors installment...
Then a suspension RNS confirming going back into receivership & liquidation.

bantamboy
25/4/2024
10:16
PATT ... you are good!!
snooker40
25/4/2024
10:16
patt - You have misunderstood the waiver. Read again what Nokia said.

"Nokia is working with the manufacturer Sanmina to produce the products after the National Telecommunications and Information Administration (NTIA) determined that OLTs and ONTs must be made in America to qualify for use in BEAD fiber projects."

ENET manufacture their own OLTs that like Nokia's are not exempt from NTIA restrictions.



"UEP3808 OLT A programmable network appliance with integrated switch for PON OLT applications, offering open interfaces for all control and management functions

PON OLT MAC SoC A programmable PON OLT integrated on an FPGA SoC, offering support for XGS-PON and/or GPON

Single-Port PON OLT MAC Device A low-cost, compact PON OLT integrated on an FPGA SoC, offering support for GPON in applications such as FTTR

pwhite73
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