BOSTON, May 17, 2024 /PRNewswire/ -- As the hunger for
high-speed internet and constant connection increases, so too does
the developments of 5G and 6G networks. The technology that makes
this possible is happening right down in the small area of the
antenna within the device, and low-loss materials and alternative
substrates can offer ways of maintaining a strong connection.
5G and 6G
While 6G is still in development, it is expected to have a band
of >100GHz and the ability to provide high speed internet, which
will offer more opportunity and availability for crowded areas like
concerts and football stadiums with its wider bandwidth. It may not
be necessary when walking along a quiet street, as 5G or 4G would
work just as well in less densely populated areas, but in busy
places where internet connection famously slows down, 6G could
bring a solution.
Multiple spectrum band services are common, including high to
low bands. MmWave is very fast and offers opportunities for
high-speed downloads and communications; however, it struggles to
reach high coverage more than a square mile and could struggle to
pass through thick walls and other physical barriers.
Mid-bands of 5G covering suburbs and cities would be the most
commercialized and most popular in newer smartphones. These
mid-high bands of 5G networks, although popular after the hype of
being released, also face issues of signal decays due to the high
frequencies at play, which packaging technologies are aiming to
eradicate, and 6G network developments could experience the same
problems. IDTechEx has deduced that around 50% of the 5G services
offered use sub-6 GHz frequency bands because they can manage
coverage and capacity more easily and are closer to commonly used
4G.
Packaging technologies and low-loss materials
Minimizing transmission losses between antenna and chips is a
main focus of packaging technologies. Even though having the
antenna on the printed circuit board (PCB) is cheaper, as
frequencies get higher, they become more delicate, and their signal
can decay as it travels across the PCB. Antenna in package (AiP)
can help resolve this issue with 5G by putting the antenna much
closer to the chip within a device, minimizing the distance the
signal has to travel.
As 6G enters the market, it is likely that this antenna in
package approach will still be useful, but the technology could
improve by eventually allowing antenna on chip placement, which is
more direct and eradicates almost all distance.
Low-loss materials (HDI) are materials with properties that
minimize transmission loss so they don't interfere with signal as
it travels, which is especially important for 5G and 6G. Low-loss
materials have a high supply chain maturity and low cost and are
currently popular as substrates within this industry; however, new
emerging substrates could have higher performance qualities. More
information on this topic can be found in IDTechEx's report,
'Low-loss Materials for 5G and 6G 2024-2034: Markets, Trends,
Forecasts'.
Emerging substrates
Fan-out packaging and glass base substrates are being developed
to have very thin line space features with more routing
opportunities and more design flexibility to minimize signal
losses. Their thinness will also make them more suitable for
smartphone devices and wearables, avoiding bulky electrical
components while reaching the same performance as other
alternatives.
With the developments of new materials for use within electronic
devices, the opportunity for fast download speed and strong
connection will be available in many more places, and the
availability of multiple high-speed bands will be broader, allowing
for faster and more satisfying communication.
For more information, visit IDTechEx's latest report, 'Antenna
in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends,
Markets'.
For further independent 5G, 6G, and telecoms-related research from
IDTechEx, please see www.IDTechEx.com/Research/5G. For the full
portfolio of market intelligence available, including research on
materials, electronics, consumer devices, wearables, thermal
management, and more, please visit www.IDTechEx.com/Research.
Downloadable sample pages are available for all reports.
About IDTechEx
IDTechEx provides trusted independent research on emerging
technologies and their markets. Since 1999, we have been
helping our clients to understand new technologies, their supply
chains, market requirements, opportunities and forecasts. For more
information, contact research@IDTechEx.com or
visit www.IDTechEx.com.
Media Contact:
Lucy Rogers
Marketing and Sales Administrator
press@IDTechEx.com
+44(0)1223 812300
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