NexTechFAS to Feature PVScan and PVAdvantage Tools at Semicon Europa 2008

  NexTech Solutions, Inc. (PINKSHEETS: NXSL) and
FAS Holdings Group, LLC, jointly doing business as "NexTechFAS," are
pleased to announce that the company will be exhibiting at Semicon Europa
2008, where they will be featuring the PVScan, an automated optical
inspection (AOI) tool, and the PVAdvantage, an extrusion deposition
(ED) tool, the latest technologies developed to drastically decrease the
costs and improve production yields in the manufacturing process of
photovoltaic (solar) products.

NexTechFAS' PVScan is an AOI system designed specifically for solar panel defect inspection. The PVScan is the result of many years of engineering study related to the various defects specific to photovoltaic substrates. The PVScan offers outstanding performance in solar panel pattern, particle and overall process defect detection. NexTechFAS' imaging, illumination and image processing technology facilitates the identification of the widest spectrum of solar panel defect types. Being able to detect defects during the production process of PV modules and correcting these defects in a timely manner not only improves production yields but significantly reduces the overall cost by identifying certain problems early in the process. To learn more about the PVScan, visit: http://www.nextechfas.com/Products/pv-scan.html

The PVAdvantage utilizes high-performance extrusion-type deposition (ED) of photovoltaic materials, including deposition of organic or inorganic solution based materials. It is available for material deposition on a variety of flexible or rigid panel sizes, from G2 to G8. The PVAdvantage serves as an extremely cost-effective solution by maximizing the deposition of material utilization without the waste associated with alternative methods. This efficient use of materials not only significantly reduces the cost associated with the waste of potentially expensive photovoltaic materials but also minimizes harm done to the environment through its containment of hazardous waste and the expensive disposal costs necessary with traditional deposition techniques. To learn more about the PVAdvantage, visit: http://www.nextechfas.com/Products/pv-advantage.html

NexTechFAS will be exhibiting at booth #710 along with John P. Kummer GmbH, NexTechFAS' exclusive sales and marketing representative in Europe. Semicon Europa is the largest exhibition in Europe for semiconductor, MEMS and photovoltaic equipment, materials and service suppliers. The Semicon Europa 2008 Conference will be held in, Stuttgart, Germany at the New Stuttgart Trade Fair Centre on Oct. 7-9, 2008.

About NFJV, LLC (NexTechFAS)

NFJV, LLC, doing business as "NexTechFAS" is the operating company of NexTech Solutions, Inc. (PINKSHEETS: NXSL) and FAS Technologies, LLC, a result of a pending merger transaction between the two companies. NexTech Solutions currently owns approximately 52 percent of NexTechFAS and will own 100 percent upon completion of the final step of the merger transaction. NexTechFAS is a Delaware limited liability company with facilities in Austin and Dallas, Texas. The company is widely recognized in the industry for the development of digital fluid dispensing and a patented extrusion coating (spinless coating) technology known as "FAS-Coat," which has become the de-facto standard in the coating processes used in the manufacture of flat panel displays (FPDs). The company also delivers advanced metrology and automation solutions, and is the first to deliver a turn-key solution for manufacturing lines in the FPD, photovoltaic and semiconductor industries. NexTech Solution's stock is quoted on the Pink Sheets under the symbol NXSL. For more information, visit: http://www.nextechfas.com.

Forward-Looking Statements

This release may include forward-looking statements that involve risks and uncertainties. Any forward-looking statements and all other statements that may be made in this news release that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially. Specific risks include delays in new product development, product performance and quality issues and the acceptance of our current and new products by the FPD and semiconductor markets.

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