Intel (NASDAQ:INTC)
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Announces Availability of Intel® Edison and 2nd
Generation LTE Modem Platforms
INTEL DEVELOPER FORUM -– Intel Corporation CEO Brian
Krzanich kicked off Intel's annual technical conference with a broad
set of computing initiatives and projects showing how the company is
moving quickly to enable new market segments where everything is smart
and connected. Krzanich and other executives announced new hardware and
software developer tools, previewed upcoming Intel technologies and
announced new products across several technology segments.
Intel CEO Brian Krzanich and President Renee James take questions from the IDF14 audience (Photo: Business Wire)
“With our diverse product portfolio and developer tools that span key
growth segments, operating systems and form factors, Intel offers
hardware and software developers new ways to grow as well as design
flexibility,” said Brian Krzanich, Intel CEO. “If it’s smart and
connected, it is best with Intel.”
During the keynote, Krzanich was joined on the keynote stage by several
Intel executives, Michael Dell, chairman and CEO of Dell*, and Greg
McKelvey, executive vice president and chief strategy and marketing
officer of the Fossil Group*.
The technical conference’s format and content were revamped this year to
appeal to an expanded range of engineers and programmers, reflecting
Intel’s efforts to extend the reach of Intel technology. The agenda and
technology showcase content expanded beyond PCs, mobile and the data
center to also include the Internet of Things (IoT) and wearables and
other new devices created by so-called “makers” and inventors. More than
4,500 people are attending the forum this week from around the world.
Developer Tools News Items
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Intel announced the Intel Reference Design for Android program
to offer tablet users a high-quality, consistent experience based on
the latest Android* operating system. Intel will help scale the
deployment process of Android for tablet manufacturers by providing
the software engineering work, streamlined access to Google Mobile
Services*, as well as support for updates and upgrades to future
Android releases.
-
Intel announced the Analytics for Wearables (A-Wear) developer program
that will accelerate development and deployment of new wearable
applications with data-driven intelligence. The developer program
integrates a number of software components, including tools and
algorithms from Intel and data management capabilities from Cloudera*
CDH all deployed on a cloud infrastructure optimized on Intel®
architecture. Developers of Intel wearables will use the A-Wear
developer program free of charge.
Intel Product Availability News Items
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Intel announced the first commercial availability of the Intel® XMM™
7260 modem, now shipping in the Samsung* Galaxy Alpha smartphone for
Europe and other regional markets. The Intel XMM 7260 and
Intel® XMM™ 7262 modems support one of the industry’s fastest mobile
standards, delivering Category 6 data rates up to 300 Mbps. The modems
are Intel’s second-generation LTE platforms and provide device
manufacturers a high-performance, power-efficient solution for the
coming wave of LTE-Advanced networks and devices.
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Intel® Edison, a postage stamp-size computer with built-in wireless
that was announced at CES, is now shipping and available. The platform
is designed to enable rapid innovation and product development from
inventors, entrepreneurs and consumer product designers by simplifying
the design process, increasing durability and providing additional
cost savings.
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AT&T* will be the exclusive carrier for the “My Intelligent
Communication Accessory” (MICA) bracelet designed by Opening Ceremony,
engineered by Intel, that was introduced last week in New York.
Product and Innovation Preview News Items
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Michael Dell and Krzanich previewed an upcoming Dell tablet with
first-of-its-kind photo capabilities. The new Dell Venue 8 7000 Series
with Intel® RealSense™ snapshot is the world’s thinnest tablet and
will be available in time for the holiday season. Intel RealSense
snapshot is an enhanced photography solution that creates a
high-definition depth map to enable measurement, refocus and selective
filters with a touch of a finger. It will introduce new capabilities
and new ways of using the tablet, opening up a new creative horizon
for developers to come up with apps that change how consumers engage
with their photos.
-
Intel® Wireless Gigabit Docking – a full wireless experience
that includes wireless docking, wireless display and wireless charging
– was demonstrated via an Intel reference design based on a 14nm
next-generation Intel processor.
-
Developers got a preview of the next generation 14nm Intel® Core™
processor for 2015.
-
Renowned physicist Stephen Hawking joined the conference via video to
discuss how technology for the disabled is often a proving ground for
the technology of the future. In connection with Hawking's video
attendance, Intel revealed for the first time a unique Connected
Wheelchair Project, a proof of concept designed by Intel interns as
part of the Intel Collaborators program. The project demonstrated how
to transform standard “things” into data-driven, connected machines
using the Intel Galileo Development Kit, based on Intel® Quark
processors, and Intel® Gateway Solutions for the IoT, featuring Wind
River* and McAfee* security products.
IDF Preview
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Developers will experience 164 technical sessions with industry and
Intel experts.
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Intel’s business units and more than 180 leading companies from around
the world will showcase 700 hands-on demonstrations of their newest
innovations and future technologies at the IDF Industry Technology
Showcase.
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During the IoT mega session this morning, Intel Vice President Doug
Davis will address interoperability and security challenges and
describe Intel’s integrated hardware and software building blocks for
edge-to-cloud IoT solutions. He will disclose that Intel is
collaborating with AT&T*, Cisco*, GE* and IBM* to create complete
solutions utilizing their platforms and Intel’s building blocks. The
companies will announce joint products that are available today in
addition to future product plans.
-
In the Intel Edison, Wearables and New Devices mega session this
afternoon, Intel Vice President Mike
Bell will preview several Intel Edison-powered prototype devices,
including a 3-D printed interactive garment and a braille printer and
embosser. Meridian Audio*, a top high-performance audio and video
component manufacturer, will also discuss how Intel Edison contributes
to advancing its wireless audio product offerings.
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During the Software Developer mega session this afternoon, Intel Vice
President Doug
Fisher will introduce tools that help developers create software
easier, faster and across ecosystems. He will also talk about the ease
with which OEMs and ODMs will be able to build a Windows-* or
Android-based device using customized tools and reference designs from
Intel.
-
In the Mobile Technology mega session this afternoon, Intel Vice
President Hermann
Eul will challenge developers to play a role in solving the
world’s most critical problems and advancing societies across the
globe, in particular in developing countries, through innovations for
the most prominent technology in people’s hands, the mobile device. He
will highlight the hardware, software and communications technologies
that will allow developers to tap into this opportunity and aid in
providing change, progress and innovation.
-
During the Data Center mega session tomorrow morning, Intel Senior
Vice President Diane
Bryant will discuss how data centers are being re-architected,
driven in large part by the rise of the digital service economy. This
session will include an update on future Intel silicon photonics
products and details on how Intel is tailoring products for individual
data center customers.
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In the PC Reinvention and Innovation mega session tomorrow morning,
Intel Senior Vice President Kirk
Skaugen will discuss how developers can address the 600 million
unit global opportunity of 4-year-old and older PCs that could be
replaced with exciting new form factors and new experiences across
multiple operating systems. Skaugen will update developers on
ChromeOS* and Intel® Wireless Display momentum, and as well as the
Alliance for Wireless Power wireless charging consortium.
Supporting Resources
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Photos:
MICA, “My Intelligent Communication Accessory”, by Opening Ceremony
and Intel
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Photo:
Intel® Edison
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Photo:
Dell Venue 8 7000 Series* with Intel RealSense Snapshot
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Fact
sheet: Intel’s 2014 LTE-Advanced Communications Platform Now Shipping
-
Blog
by Intel Vice President Doug Fisher: Intel Reference Design for Android
-
Blog
by Intel Vice President Mike Bell: Intel, Fossil to Advance Wearable
Designs
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IDF14
keynote webcast
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IDF14
virtual media kit
About Intel
Intel (NASDAQ:INTC) is a world leader in computing innovation. The
company designs and builds the essential technologies that serve as the
foundation for the world’s computing devices. As a leader in corporate
responsibility and sustainability, Intel also manufactures the world’s
first commercially available “conflict-free” microprocessors. Additional
information about Intel is available at newsroom.intel.com
and blogs.intel.com,
and about Intel’s conflict-free efforts at conflictfree.intel.com.
Intel, Intel Core, Intel RealSense, XMM, Quark and the Intel logo are
trademarks of Intel Corporation in the United States and other countries.*Other
names and brands may be claimed as the property of others.
Photos/Multimedia Gallery Available: http://www.businesswire.com/multimedia/home/20140909006260/en/
IntelLaura Anderson, 480-552-9020Laura.m.anderson@intel.com