GOWIN Semiconductor to Attend InfoComm 2024
09 May 2024 - 4:29PM
GOWIN Semiconductor Corporation, a global leader in FPGA technology
and the fastest-growing provider in the industry, is thrilled to
announce its debut participation at InfoComm 2024, taking place
from June 12th to 14th in Las Vegas, United States. This milestone
coincides with GOWIN's tenth anniversary, marking a significant
moment in our journey. Join us at booth W1352, where we will unveil
our latest FPGA innovations and demonstrate their transformative
capabilities.
InfoComm stands as North America's premier
audiovisual trade show, uniting manufacturers, integrators,
dealers, and end-users worldwide to explore cutting-edge
technologies, products, and services. At this esteemed event, we
will present our groundbreaking FPGA offerings, notably
highlighting the Arora V series. Renowned for their unparalleled
SerDes performance and energy efficiency, these devices leverage
TSMC’s 22nm LP process with proven automotive grade-1 capability,
poised to redefine the mid-density FPGA market. Moreover, our new
lineup offers exceptional power efficiency paired with competitive
pricing, alongside compatibility with various competitor
pin-compatible package options, facilitating seamless integration
without PCB hardware redesign.
Our booth will feature live demonstrations
showcasing the versatility and power of our FPGA solutions,
including MIPI CSI camera to HDMI display bridging utilizing the
Arora-V GW5A-25 family, a Universal Audio Class (UAC2) USB2.0 2x2
audio interface powered by the cost-effective LittleBee Flash-based
GW1N-9 family, and a captivating beam forming demo.
In a special highlight, we are thrilled to
announce that our esteemed CEO, Jason Zhu, will be joining our
field sales team to engage in exclusive meetings with invited
customers and partners. For those seeking visionary insights into
the FPGA industry, this is an unparalleled opportunity to connect
with a leader driving innovation.
Scott Casper, Senior Director of Sales,
Americas, expressed his enthusiasm, stating, “We are incredibly
excited to make our inaugural appearance at InfoComm, presenting
our expanding portfolio of products, IP, and pioneering solutions.
This event underscores our commitment to leadership in the evolving
low and mid-density FPGA landscape.”
GOWIN Semiconductor eagerly anticipates
welcoming all prospective customers and partners to booth W1352,
where together, we'll explore the boundless possibilities of FPGA
technology.
Supporting Resources:
- For more information about GOWIN
Semiconductor, please visit: https://www.gowinsemi.com/en/
- For more information about and to
register for the conference, visit
https://www.infocommshow.org/
About GOWIN Semiconductor
Corporation
Founded in 2014, Gowin Semiconductor Corp.,
headquartered with major R&D in China, has the vision to
accelerate customer innovation worldwide with our programmable
solutions. We focus on optimizing our products and removing
barriers for customers using programmable logic devices. Our
commitment to technology and quality enables customers to reduce
the total cost of ownership from using FPGA on their production
boards. Our offerings include a broad portfolio of programmable
logic devices, design software, intellectual property (IP) cores,
reference designs, and development kits. We strive to serve
customers in the consumer, industrial, communication, medical, and
automotive markets worldwide.
Copyright 2024 GOWIN Semiconductor Corp. GOWIN,
LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN
EDA and other designated brands included herein are trademarks of
GOWIN Semiconductor Corp. in China and other countries. All other
trademarks are the property of their respective owners. For more
information, please email info@gowinsemi.com
Media Contact:Andrew
Dudaronekandrew@gowinsemi.com