Infineon Introduces DECT 6.0 / CAT-iq Chipset with Texas Instruments' Puma 5 DOCSIS 3.0 Cable Modem Solution

  
    
  
  
    
      Today at the 2008 Cable TV Show, Infineon Technologies AG (FWB:IFX) 
      (NYSE:IFX) announced a cost-effective DECT solution, which when combined 
      with a DOCSIS 3.0 chipset, produces a platform for North American cable 
      service providers to deploy next-generation Voice-over-IP (VoIP) 
      services operating over DECT 6.0 cordless telephones. The resulting 
      platform, which combines Infineon’s COSIC™-Modem 
      and DUSLIC™-xT with Texas Instruments’ 
      (NYSE:TXN) PUMA-5 chipset, enables system integrators to develop eMTA 
      (Embedded Terminal Media Adapter) products that conform to the latest 
      standards in DOCSIS® 
      3.0 (Data Over Cable Service Interface Specification), and the latest 
      DECT 6.0 / CAT-iq™ cordless telephony 
      standards.
    
    
      The new platform unlocks additional revenue potential for cable service 
      providers by offering the benefits of a user-installable VoIP solution, 
      which require no home phone wiring or truck rolls, with extended 
      features that enable the provision of additional revenue-generating 
      services to the end user. The consumer will benefit from 
      interference-free cordless phones that offer wideband audio (“HD”sound) 
      and support for multiple concurrent calls to separate external parties, 
      along with new Internet-like applications on the handset, such as access 
      to online address books, buddy lists, and stock and weather tickers. The 
      eMTA with integrated DECT 6.0 is also capable of continued service 
      during power failure since the base station is powered by the eMTA’s 
      standby battery, and the handsets feature more than 170 hours of standby 
      and over 15 of talk-time.
    
    
      "Infineon's COSIC-Modem chipset offers a low-cost, full feature add-on 
      to our DOCIS 3.0 TI's Puma 5 cable modem chipset, which allows 
      applications and platforms to leverage the flexible architecture of the 
      industry’s first DOCSIS 3.0 compliant 
      solution and draws on TI’s extensive Voice 
      over Cable experience to meet diverse VoIP market needs," said Ran 
      Senderovitz, Cable Business Manager of Texas Instruments. "The DECT 
      enabled eMTA platform, with features based on TI's Puma 5 chipset, 
      offers cable manufacturers and MSOs the ability to deliver a completely 
      new telephony experience to the consumer."
    
    
      “By combining Texas Instruments’ 
      cable modem with Infineon’s field-proven DECT 
      and SLIC™ products, we can now offer a 
      unified platform that supports both next-generation DECT cordless 
      telephones, as well as legacy analog phones,” 
      said Ulrich Huewels, Vice President of CPE products in the Communication 
      Business Group at Infineon Technologies AG. “This 
      modular solution enables OEM customers to develop a family of products 
      that meet the requirements of the world-wide customer base.”
    
    
      The DECT-enabled eMTA platform includes Texas Instruments’ 
      PUMA-5 DOCSIS 3.0-based (Data Over Cable Service Interface 
      Specification) cable modem chipsets, optimized for triple play and 
      next-generation IP services; Infineon’s COSIC 
      family optimized for DECT 6.0 / CAT-iq base station, handset and VoIP 
      gateways; and Infineon’s DUSLIC-xT 
      (Dual-channel Subscriber Line Interface Circuit) device for voice and 
      VoIP-enabled device.
    
    
      About Infineon’s COSIC Family
    
    
      Infineon’s COSIC family is a monolithic 
      cordless IC that enables the most optimized DECT 6.0 / CAT-iq Handset 
      and Base Station / VoIP Gateway solution for the residential 
      environment. The flexible and scalable feature-set supports all relevant 
      standards including DECT, DECT 6.0 and CAT-iq. The COSIC devices 
      includes a baseband controller, RF transceiver and power amplifier on 
      the same chip with the lowest system bill-of-material cost, best 
      optimized manufacturing and logistics, simplified development and 
      design, and best-in-class system performance.
    
    
      For more information about Infineon’s DECT 
      and DuSLIC-xT products, please visit: www.infineon.com/dect 
      and www.infineon.com/duslic-xt
    
    
      Availability
    
    
      This DECT-enabled eMTA solution will be available the second half of 
      2008.
    
    
      For more information about TI’s Puma family 
      of DOCSIS 3.0 products, please visit: http://www.ti.com/corp/docs/landing/puma5
    
    
      About Infineon
    
    
      Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and 
      system solutions addressing three central challenges to modern society: 
      energy efficiency, communications, and security. In the 2007 fiscal year 
      (ending September), the company reported sales of Euro 7.7 billion 
      (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 
      employees worldwide (including approximately 13,500 Qimonda employees). 
      With a global presence, Infineon operates through its subsidiaries in 
      the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, 
      and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock 
      Exchange and on the New York Stock Exchange (ticker symbol: IFX).
    
    
      Further information is available at www.infineon.com.
    
    
      This news release is available online at www.infineon.com/press/