VIA optronics AG to Showcase its Technologies at the 30th Annual SID Vehicle Displays & Interfaces Symposium and Expo

VIA optronics AG (NYSE: VIAO) (“VIA” or the “Company”), a leading supplier of interactive display systems and solutions, today announced that it will present an exhibit at the Society for Information Display (SID) Vehicle Displays & Interfaces 30th Annual Symposium & Expo. The event will take place on September 26th and 27th, at Huntington Place in Detroit, Michigan.

Roland Chochoiek, CEO of VIA optronics, commented, “It´s a pleasure to participate at SID’s annual symposium again, and we look forward to having another opportunity to exhibit our portfolio of interactive display solutions. Our team is excited to meet and engage with our customers and partners.”

The Company will showcase a demonstration of its Interactive Display System (IDS) with multiple displays bonded on one curved cover glass. Further, the demo will include VIA’s unique copper metal mesh touch sensor technology for high-performing touch functions and automotive camera technology for mirror replacement.

About VIA:

VIA is a leading provider of interactive display solutions for multiple end markets in which superior functionality or durability is a critical differentiating factor. Its customizable technology is well-suited for high-end markets with unique specifications and demanding environments that pose technical and optical challenges for displays, such as bright ambient light, vibration and shock, extreme temperatures, and condensation. VIA’s interactive display systems combine system design, interactive displays, software functionality, cameras, and other hardware components. VIA’s intellectual property portfolio, process know-how, optical bonding, metal mesh touch sensor and camera module technologies provide enhanced display solutions built to meet the specific needs of its customers.

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Investor Relations for VIA optronics:

Griffin Morris Margaret Jones Alpha IR Group [e-mail] Phone: [phone]

Media: Alexandra Müller-Pl�tz [e-mail] Phone: [phone]