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Share Name | Share Symbol | Market | Type |
---|---|---|---|
Solaris Oilfield Infrastructure Inc | NYSE:SOI | NYSE | Common Stock |
Price Change | % Change | Share Price | High Price | Low Price | Open Price | Shares Traded | Last Trade | |
---|---|---|---|---|---|---|---|---|
0.02 | 0.22% | 9.06 | 9.11 | 8.88 | 8.96 | 214,340 | 01:00:00 |
As eSI offers the best cost performance trade-off,, Soitec is seeing very strong and growing market demand from most of the leading RF foundries. These customers are already shipping wireless-communication ICs built on eSI substrates. As a result, Soitec is now shipping more eSI products than high-resistivity silicon-on-insulator (HR-SOI) wafers, which are also used in fabricating RF devices.
"In a very short time, our eSI product has been widely adopted by most of the leading foundries considering it to be the substrate of choice for their products," said Bernard Aspar, senior vice president and general manager of Soitec's Communication & Power Business Unit. "This shows that we have demonstrated our SOI innovation leadership and our ability to move quickly to high volume production. In parallel, we are already working on next generation products to address future LTE Advanced challenges."
Soitec's eSI substrates: Soitec's innovative eSI products, based on Smart Cut(TM) technology, are the first 'trap-rich' type of material in full production. These substrates, on which devices are manufactured, have a significant impact on the final devices' performance. Soitec's eSI substrates are designed by introducing an innovative material (a trap-rich layer) between the high-resistivity handle wafer and the buried oxide. This layer limits the parasitic surface conduction present in standard high-resistivity silicon-on-insulator (HR-SOI) substrates, boosting the performance of RF devices. Because this layer is built into the substrate, it reduces the number of process steps and relaxes design rules, leading to a highly competitive performance and die cost, including a smaller area per function. RF designers can therefore integrate diverse functions such as switches, power amplifiers and antenna tuners with excellent RF isolation, good insertion loss, better thermal conductivity and better signal integrity than other technologies.
About Soitec: Soitec is an international manufacturing company, a world leader in generating and manufacturing revolutionary semiconductor materials at the frontier of the most exciting energy and electronic challenges. Soitec's products include substrates for microelectronics (most notably SOI: silicon-on-insulator) and concentrator photovoltaic systems (CPV). The company's core technologies are Smart Cut(TM), Smart Stacking(TM) and Concentrix(TM), as well as expertise in epitaxy. Applications include consumer and mobile electronics, microelectronics-driven IT, telecommunications, automotive electronics, lighting products and large-scale solar power plants. Soitec has manufacturing plants and R&D centers in France, Singapore, Germany and the United States. For more information, visit: www.soitec.com.
International Media Contacts (trade press) Camille Dufour +33 (0)6 79 49 51 43 camille.dufour@soitec.com (business press) Marylen Schmidt +33 (0) 4 76 92 87 83 marylen.schmidt@soitec.com | Investor Relations Olivier Brice +33 (0)4 76 92 93 80 olivier.brice@soitec.com |
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Soitec press release in PDF http://hugin.info/143589/R/1818732/629501.pdf
HUG#1818732
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