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NEC Electronics and Cadence Announce Encounter Platform to Support NEC
Electronics' ISSP Structured ASIC Platform
Customers Using Industry-Leading Structured ASIC Platform Will See Faster Design
Turnaround With Support of Popular IC Design System
Calif., Dec. 10 /PRNewswire/ -- NEC Electronics Corp. with its global
affiliates and Cadence(R) Design Systems Inc. today announced that the NEC
Electronics' Instant Silicon Solution Platform(TM) (ISSP(TM)) family of
structured ASICs will be supported by Cadence's Encounter(TM) digital IC design
platform. When used in the back end of the ISSP design flow, Encounter can
reduce design turnaround time by up to 50 percent compared to conventional
design flows, which means ISSP customers can bring products to market much more
quickly.
NEC Electronics' ISSP devices provide a cost-effective, high-function,
easy-to-design, fast turnaround ASIC architecture ideal for designs requiring
low- to mid-range production volumes. Customers using ISSP provide NEC
Electronics or a certified design house participating in NEC Electronics' ISSP
Open Alliance Program with a netlist of the IC design. As a result of today's
announcement, NEC Electronics or the design house can then complete the
remainder of the design flow in a greatly expedited manner.
"For the continued success of our ISSP products, it is important for NEC
Electronics to work with leading EDA tool vendors to ensure that their products
support our platform," said Dr. Hitoshi Yoshizawa, general manager, 3rd custom
LSI division, NEC Electronics. "Cadence is recognized worldwide as a top
supplier of electronic design technologies, which made our decision to use the
Encounter design flow an easy one. Additionally, Encounter's NanoRoute engine
helped deliver excellent routing results while guaranteeing signal integrity."
"We are very pleased with the outcome of our integration activity with NEC
Electronics," said Lavi Lev, executive vice president and general manager of
Cadence's IC business unit. "ISSP is an important new silicon platform in the
ASIC marketplace, and its core characteristics of high performance and short
turnaround time are a synergistic match with the characteristics of our
Encounter platform. We are particularly pleased that NEC Electronics now has a
common implementation platform between its standard ASIC and ISSP offerings, as
this further enhances the efficiency of its design organization."
About ISSP
The ISSP architecture was designed to serve the growing number of applications
that require higher complexity and performance than an FPGA but cannot bear the
high development costs associated with cell-based ASICs. Each NEC Electronics
ISSP design begins with a prefabricated master composed of an array of complex
multi-gates, embedded IP cores, built-in test circuits, clock domains and power
lines. The upper metal layers are easily and quickly placed, routed and
fabricated to satisfy the unique requirements of each individual design.
ISSP-based products consume much less power than a comparable FPGA and also have
lower NRE costs than cell-based ASIC devices.
About Encounter for ISSP
The Encounter platform is a new-generation IC implementation system used for
completing large-scale system-on-chip (SoC) designs within short, predictable
development cycles, from synthesis and silicon virtual prototyping through final
chip implementation. ISSP support in Encounter allows fast, full-chip timing
closure with integrated SI-aware routing.
About Cadence
Cadence is the largest supplier of electronic design technologies, methodology
services, and design services. Cadence solutions are used to accelerate and
manage the design of semiconductors, computer systems, networking and
telecommunications equipment, consumer electronics, and a variety of other
electronics-based products. With approximately 5,000 employees and 2002 revenues
of approximately $1.3 billion, Cadence has sales offices, design centers, and
research facilities around the world. The company is headquartered in San Jose,
Calif., and traded on the New York Stock Exchange under the symbol CDN. More
information about the company, its products and services is available at
http://www.cadence.com/.
About NEC Electronics
NEC Electronics Corporation (TSE:6723) specializes in semiconductor products
encompassing advanced technology solutions for the high-end computing and
broadband networking markets, system solutions for the mobile handsets, PC
peripherals, automotive and digital consumer markets, and platform solutions for
a wide range of customer applications. NEC Electronics Corporation has 24
subsidiaries worldwide including NEC Electronics America, Inc. and NEC
Electronics (Europe) GmbH. In addition to marketing, selling and supporting NEC
Electronics products to customers in their respective regions, NEC Electronics
America and NEC Electronics Europe also operate local manufacturing facilities
in Roseville, California, and Ballivor, Ireland, respectively. Additionally, NEC
Electronics America and NEC Electronics Europe are the sales and marketing
channels for NEC AM-LCD and PDP modules in their individual countries. For
additional information about NEC Electronics worldwide, visit
http://www.necel.com/.
NOTE: Instant Silicon Solution Platform, ISSP and NEC Electronics are either
trademarks or registered trademarks of NEC Electronics Corporation in the United
States and/or other countries. Cadence and SoC Encounter are registered
trademarks of Cadence Design Systems, Inc. in the U.S. and other countries. All
other names mentioned herein are the trademarks or registered trademarks of
their owners.
DATASOURCE: NEC Electronics Corporation
CONTACT: Japan, Seiko Yabuuchi of NEC Electronics Corp.,
+81-44-435-1664, or ; or United States,
Denise Viereck Garibaldi of NEC Electronics America, Inc., +1-408-588-6620, or
; or Europe, Oliver Luettgen of NEC Electronics
(Europe)GmbH, +49-211-6503-469, or ; or Carolyn Robinson of
Hoffman Agency, +1-408-975-3065, or , for Cadence Design
Systems, Inc.
Web site: http://www.cadence.com/
Web site: http://www.necel.com/