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NVIDIA Adopts TSMC's 0.11 Micron Technology
SANTA CLARA, California and HSIN-CHU, Taiwan, February 24 /PRNewswire/ -- -
Deep Sub-Micron Process Technology Allows for Better Performance and
Power Improvements
NVIDIA Corporation (Nasdaq: NVDA) today confirmed that it will be one of
the first semiconductor companies to manufacture select up-coming graphics
processing units (GPUs) at Taiwan Semiconductor Manufacturing Company's
(TSMC's) (TAIEX: 2330; NYSE: TSMC) 0.11 um (micron) processtechnology.
NVIDIA will combine TSMC's 0.11 micron process with its own innovative
engineering designs, to deliver high-performance and low-power consumption in
a graphics processor.
(Photo: NewsCom: http://www.newscom.com/cgi-bin/prnh/20020613/NVDALOGO )
"The decision to move to this new process underscores our long-standing
relationship between TSMC and NVIDIA," stated Di Ma, vice president of
operations at NVIDIA. "This new manufacturing technology, along with
numerous architectural enhancements, enables us to continue delivering
products that allow end users to interact with a wide variety of digital
devices. We look forward to the new opportunities this advancement will allow
us."
"TSMC is committed to innovative collaboration with forward-looking
companies such as NVIDIA," said Kenneth Kin, senior vice president of
worldwide marketing and sales for TSMC. "Through these relationships, we can
deliver technology platforms that create new opportunities for our
customers."
TSMC's 0.11 micron process technology is fundamentally a
photolithographic shrink of its industry-leading 0.13 micron process. The
process will be available in both high-performance and general-purpose
versions using FSG-based dielectrics. Though actual results are design-
dependent, TSMC's 0.11 micron high-performance process also includes
transistor enhancements that improve speed and reduce power consumption
relative to its 0.13 micron FSG-based technology.
TSMC began 0.11 micron high-performance technology development in 2002
and product qualified the process in December of 2003. Design rules, design
guidelines, SPICE and SRAM models have been developed, and third-party
compilers are expected tobe available in March. Yields have already reached
production-worthy levels and the low-voltage version has already ramped into
volume production. The 0.11 micron general-purpose technology is expected to
enter risk production in the first quarterof next year.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry industry's largest
portfolio of process-proven library, IP, design tools and reference flows.
The company operates one advanced 300mm wafer fab, five eight-inch fabs and
one six-inch wafer fab. TSMC also has substantial capacity commitments at
two joint ventures fabs (VIS and SSMC) and at its wholly-owned subsidiary,
WaferTech. In early 2001, TSMC became the first IC manufacturer to announce
a 90-nm technology alignment program with its customers. TSMC's corporate
headquarters are in Hsin-chu, Taiwan. For more information about TSMC see
http://www.tsmc.com .
About NVIDIA
NVIDIA Corporation is a market leader in visual computing technology
dedicated to creating products that enhance the interactive experience on
consumer and professional computing platforms. Its graphics and
communications processors have broad market reach and are incorporated into a
wide variety of computing platforms, including consumer digital-media PCs,
enterprise PCs, professional workstations, digital content creation systems,
notebook PCs, military navigation systems and video game consoles. NVIDIA is
headquartered in Santa Clara, California and employs more than 1,800 people
worldwide. For more information, visit the Company's Web site at
http://www.nvidia.com .
Certain statements in this press release, including any statements
relating to the Company's performance expectations for NVIDIA's family of
products and expectations of continued revenue growth, are forward-looking
statements that are subject to risks and uncertainties that could cause
results to be materially different than expectations. Such risks and
uncertainties include, but are not limited to, manufacturing and other delays
relating to new products, difficulties in the fabrication process and
dependence of the Company on third-party manufacturers, general industry
trends including cyclical trends in the PC and semiconductor industries, the
impact of competitive products and pricing alternatives, market acceptance of
the Company's new products, and the Company's dependence on third-party
developers and publishers. Investors are advised to read the Company's
Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the
Securities and Exchange Commission, particularly those sections entitled
"Certain Business Risks," for a fuller discussion of these and other risks
and uncertainties.
NOTE: All company and/or product names may be trade names, trademarks
and/or registered trademarks of the respective owners with which they are
associated. Features, pricing, availability, and specifications are subject
to change without notice.
NOTE TO EDITORS: If you are interested in viewing additional information
on NVIDIA, please visit the NVIDIA Press Room at
http://www.nvidia.com/page/press_room.html/
Web site: http://www.tsmc.com
Web site: http://www.nvidia.com
DATASOURCE: NVIDIA Corporation
CONTACT: Derek Perez, Director of Public Relations of NVIDIA, +1-408-486-2512,
or dperez@nvidia.com; or Dan Holden, PR Manager of TSMC North America,
+1-408-382-7921, or dholden@tsmc.com; Photo: NewsCom:
http://www.newscom.com/cgi-bin/prnh/20020613/NVDALOGO; AP Archive:
http://photoarchive.ap.org; PRN Photo Desk, 888-776-6555 or +1-212-782-2840