Xilinx Corporate VP Liam Madden to Deliver Keynote at 3-D Architectures for Semiconductor Integration & Packaging Conference

        






Xilinx Corporate VP Liam Madden to Deliver Keynote at 3-D Architectures for Semiconductor Integration & Packaging Conference

SAN JOSE, Calif., Dec. 5, 2012 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced that Xilinx corporate vice president, Liam Madden, will deliver a keynote address at the 3D Architectures for Semiconductor Integration & Packaging conference taking place next week at the Sofitel San Francisco Bay hotel in Redwood City, Calif., December 12-14, 2012.  

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Madden will open the Critical Perspectives on 3D IC keynote session on Thursday morning, followed by executives from Micron Technology, Cadence Design Systems, Global Foundries and Ericsson.  Speakers will delve into 3D IC opportunities and challenges facing the industry from the perspective of semiconductor, EDA, foundry and systems companies.

What:	3D Architectures for Semiconductor Integration & Packaging
Where:	Sofitel San Francisco Bay
When:	December 12-14, 2012

Thursday, December 13
8:00 a.m. - 8:30 a.m.

Advancing High Performance Heterogeneous Products through Die Stacking
Today's 3D die stacking technology increases aggregate inter-chip bandwidth and shrinks board footprint while reducing I/O latency and energy consumption. By integrating in one package multiple tightly-coupled semiconductor dice, this technology gives system designers additional options to partition and scale solutions efficiently. 

In his talk, Madden will describe historical and current challenges driving the need for radical improvements in system-level IC integration; economic and technology forces that have aligned to enable 3D IC 'stacking' technology; pioneering advancements resulting in delivery of the world's first All Programmable homogeneous and heterogeneous 3D FPGAs; and examples of key applications already benefiting from today's 3D heterogeneous FPGAs. Madden's talk will conclude with an overview of key 3D challenges facing our industry.

About the 3-D Architectures for Semiconductor Integration & Packaging Conference
The 3-D Architectures for Semiconductor Integration and Packaging Conference is part of RTI (Research Triangle Institute) International's Technology Venture Forum Series, which seeks to provide insight on the impact of significant emerging technologies. For more information on the conference, please visit: http://techventure.rti.org/index.html.

About Xilinx
Xilinx is the world's leading provider of programmable platforms. For more information, visit: http://www.xilinx.com/.

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Xilinx, Inc. Lisa Washington 408-626-6272 [e-mail]

SOURCE Xilinx, Inc.

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