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Share Name | Share Symbol | Market | Type |
---|---|---|---|
NXP Semiconductors NV | NASDAQ:NXPI | NASDAQ | Common Stock |
Price Change | % Change | Share Price | Bid Price | Offer Price | High Price | Low Price | Open Price | Shares Traded | Last Trade | |
---|---|---|---|---|---|---|---|---|---|---|
9.07 | 3.67% | 256.20 | 256.12 | 256.28 | 261.15 | 250.51 | 257.72 | 2,868,032 | 20:14:24 |
News Highlights:
The new ultra-thin MOB10 is designed to combat electronic document fraud by enabling slimmer and more secure eDatapages, eCovers and ID card inlays that are harder to forge or modify. The ultra-thin profile of 200 μm makes it possible to accommodate new security features and still include the secure microcontroller and its antenna without adding bulk to passports, national eID cards, eHealth cards, citizenship cards, resident cards, driver licenses, and smart cards. For passports, the MOB10 now allows the IC to be moved from the cover of the passport booklet to the personal data page within the inside of the passport. This new feature offers additional security by preventing attempts to peel off or re-insert the IC after tampering. Additionally, the MOB10 is designed to reduce micro-cracks, sustain mechanical and environmental stresses, and is less susceptible to reverse-engineering or other security attacks.
“We are experiencing increased demand for slimmer solutions that can meet the future embedding requirements needed to produce thinner, and more cost-effective identity documents,” said Sebastien Clamagirand, general manager of the secure identification business line at NXP. “As the world’s thinnest contactless chip module, the MOB10 is uniquely suited to answer this need and will empower a new generation of passports and ID cards that are thinner, more durable and even more secure than ever before.”
The MOB10 is designed for high volume and offers higher density per reel. This feature optimizes machine throughput and storage space, so manufacturers of identity documents can reduce cost, operate more efficiently, and deliver more resilient end products. To ensure flexibility in implementation, the MOB10 solution is compatible with ICAO 9303 and ISO/IEC 14443 standards.
NXP Webinar To learn more about the MOB10, NXP will host a webinar on Wednesday, November 8 between 12-8 a.m. PST. To register for the free webinar, click here.
About NXP SemiconductorsNXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy, and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 31,000 employees in more than 33 countries and posted revenue of $9.5 billion in 2016. Find out more at www.nxp.com.
NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © 2017 NXP B.V.
For more information, please contact:
Americas | Greater China/Asia | Europe |
Tate Tran | Esther Chang | Martijn van der Linden |
Tel: +1 408 802 0602 | Tel: +886 2 8170 9990 | Phone: +31 6 1091 4896 |
Email: tate.tran@nxp.com | Email: esther.chan@nxp.com | Email: martijn.van.der.linden@nxp.com |
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