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Share Name | Share Symbol | Market | Type |
---|---|---|---|
Kulicke and Soffa Industries Inc | NASDAQ:KLIC | NASDAQ | Common Stock |
Price Change | % Change | Share Price | Bid Price | Offer Price | High Price | Low Price | Open Price | Shares Traded | Last Trade | |
---|---|---|---|---|---|---|---|---|---|---|
-1.16 | -2.46% | 46.00 | 44.07 | 47.83 | 47.47 | 46.25 | 46.69 | 576,637 | 22:41:44 |
Pennsylvania
|
|
000-00121
|
|
23-1498399
|
(State or Other Jurisdiction
of Incorporation)
|
|
(Commission File Number)
|
|
(I.R.S. Employer
Identification No.)
|
23A Serangoon North Avenue 5, #01-01 K&S Corporate Headquarters, Singapore
|
|
554369
|
(Address of Principal Executive Offices)
|
|
(Zip Code)
|
ý
|
Rule 13p-1 under the Securities Act (17 CFR 240.13p-1) for the reporting period from January 1 to December 31, 2016
|
|
|
Business Line
|
|
Product Name (1)
|
|
Typical Served Market
|
|
|
|
|
|
Ball bonders
|
|
IConn
PS
PLUS
series (2) (3) (4)
|
|
Advanced and ultra fine pitch applications
|
|
|
|
|
|
|
|
IConn
PS
ProCu
PLUS
series
(2) (3)
|
|
High-end copper wire applications demanding advanced process capability and high productivity
|
|
|
|
|
|
|
|
IConn
PS
MEM
PLUS
series
|
|
Memory applications
|
|
|
|
|
|
|
|
ConnX
PS
PLUS
series (2) (3) (4)
|
|
High productivity bonder for low-to-medium pin count applications
|
|
|
|
|
|
|
|
ConnX
PS
LED
|
|
LED applications
|
|
|
|
|
|
|
|
ConnX
PS
LED
PLUS
|
|
LED applications
|
|
|
|
|
|
Wedge bonders
|
|
3600
PLUS
|
|
Power hybrid and automotive modules using either heavy aluminum wire or PowerRibbon®
|
|
|
|
|
|
|
|
3700
PLUS
|
|
Hybrid and automotive modules using thin aluminum wire
|
|
|
|
|
|
|
|
PowerFusion
PS
TL
|
|
Power semiconductors using either aluminum wire or PowerRibbon®
|
|
|
|
|
|
|
|
PowerFusion
PS
HL
|
|
Smaller power packages using either aluminum wire or PowerRibbon®
|
|
|
|
|
|
|
|
Asterion
TM
|
|
Power hybrid and automotive modules with extended area using heavy and thin aluminum
|
|
|
|
|
|
|
|
Asterion
TM
EV
|
|
Extended area for battery bonding and dual lane hybrid module bonding
|
|
|
|
|
|
Advanced Packaging
|
|
AT Premier
PLUS
|
|
Advanced wafer level bonding application
|
|
|
|
|
|
|
|
APAMA C2W
|
|
Thermo-compression for chip-to-wafer, HA FC and high density fan-out wafer level packaging ("HD FOWLP") bonding applications
|
|
|
|
|
|
|
|
Hybrid Series
|
|
Advanced packages assembly applications requiring high throughput such as flip chip, WLP, FOWLP, embedded die, SiP, package-on-package ("POP"), and modules
|
Business Line
|
|
Product Name (1)
|
|
Typical Served Market
|
|
|
|
|
|
Electronics Assembly
|
|
iX Series
|
|
Advanced Surface Mount Technology ("SMT") applications requiring extremely high output of passive and active components
|
|
|
|
|
|
|
|
iFlex Series
|
|
Advanced SMT applications requiring multi-lane or line balancing solutions for standard or oddform passive and active components
|
•
|
Supplier Letter - Notification to suppliers that K&S is subject to Section 1502 of the Dodd-Frank Act, that K&S needs to comply and that their cooperation is requested.
|
•
|
K&S Conflict Minerals Policy
|
•
|
Conflict Minerals K&S Training Presentation
|
•
|
CMRT
|
Item 2.01
|
Exhibits.
|
|
|
Exhibit No.
|
Description
|
1.01
|
Conflict Minerals Report as required by Items 1.01 and 1.02 of this Form.
|
|
KULICKE AND SOFFA INDUSTRIES, INC.
|
|
|
|
|
Date: May 17, 2017
|
By:
|
/s/ JONATHAN CHOU
|
|
|
Jonathan Chou
|
|
|
Executive Vice President and Chief Financial Officer
|
Exhibit No.
|
Description
|
1.01
|
Conflict Minerals Report as required by Items 1.01 and 1.02 of this Form.
|
1 Year Kulicke and Soffa Indust... Chart |
1 Month Kulicke and Soffa Indust... Chart |
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