EMC-3D Consortium Created for the Development of Cost-Effective 3D Thru-Silicon-Via Interconnect

Equipment Providers, Materials Companies and Researchers Join in an International Consortium to Address Complex Integration of Thru-Silicon-Via (TSV) 3D Chip Interconnect 


SALZBURG, Austria, Oct. 11  /PRNewswire-FirstCall/ -- EMC-3D is a new consortium created to address the technical and cost issues of creating 3D interconnects using TSV technology for chip stacking and MEMS/sensors packaging.  Several major equipment manufactures have joined with material companies to work with key research groups to address the issues of cost-effective manufacturing and integration.  Equipment companies initiating the consortium are Alcatel (Paris: CGEP.PA and NYSE: ALA), EV Group, Semitool (NASDAQ:SMTL) and XSiL.

Associate research members include Fraunhofer IZM, SAIT (Samsung Advanced Institute of Technology), KAIST (Korea Advanced Institute of Science and Technology) and TAMU (Texas A&M University).  Material members include Rohm and Haas, Honeywell, Enthone, and AZ with wafer service support from Isonics (NASDAQ:ISON).

The consortium will develop processes for creating micro vias between 5 and 30um on thinned 50um 300mm wafers using both via-first and via-last techniques.  Major processes being integrated into the EMC-3D program are via etch and laser drill, insulator/barrier/seed deposition, micro via patterning with RDL capabilities, high aspect ratio Cu plating, carrier bonding, sequential wafer thinning, backside insulator/barrier/seed deposition, backside lithography, backside contact metal plating, chip-to-wafer placement and attach, and dicing.  In addition, wafer-to-wafer attach, dicing and de-bonding will also be demonstrated.  Cost of ownership goal for the integrated 3D process is $200usd per wafer.

About EMC-3D (or EMC3D)

EMC3D (Semiconductor 3D Equipment and Materials Consortium) was created in September 2006 to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process.  TSV processes will be developed for chip integration and MEMS/sensor packaging that are based on plated metal electrodes and thinned wafers.  For more information, see http://www.emc3d.org/.

  Contacts for EMC3D Members include:

  Equipment Members:


Alcatel, France; (Paris: CGEP.PA and NYSE: ALA) Jean-Marc Gruffat, Director of Business Development 

      Technology: Si and dielectric etching using DRIE
  EV Group, Austria; Thorsten Matthias, Director of Technology North America
      Technology: bonding, thin wafer handling, mask alignment lithography,
      conformal coat and develop
  Semitool Inc, USA; (NASDAQ:SMTL), Bioh Kim, Director of 3D Interconnect
      Technology: electroplating, metal/barrier etch, photoresist strip,
      wafer cleaning and thinning


XSiL Ltd, Ireland; Richard F. Toftness, Vice President of Business Development

      Technology: Si laser machining, via drilling, and wafer dicing
  Isonics Corp, USA; (NASDAQ:ISON) Kim Bell, Director of Sales
      Technology: wafer service (reclaim and test wafers, wafer thinning,
      and thick-film SOI wafers)

  Materials Members:
  AZ Electronic Materials, USA; Aldo Orsi, Global Product Manager
      Technology:  positive and negative acting photoresists


Enthone (Cookson Electronics), USA; Kristian Story, Key Account and Regional Line Manager

Technology:  chemistry for electroplating and metal etch

Honeywell Electronic Materials, USA; (NYSE:HON) Brian Larabee, Strategic Marketing Director

      Technology: thermal spreaders, thermal interface materials, and
      electrical interconnect products
  Rohm and Haas, USA; Bob Forman, Advanced Packaging Business Manager
      Technology: chemistry for lithography, plating, etching, dielectric
      formation, and bonding

  Technology Members:
  Fraunhofer IZM, Germany; Jurgen Wolf, Group and Project Manager


KAIST (Korea Advanced Institute of Science and Technology), Korea; Dr. Kyung-Wook Paik, Professor

SAIT (Samsung Advanced Institute of Technology), Korea; Dr. Yoon-Chul Sohn, Researcher

TAMU (Texas A&M University), USA; Dr. Manuel Soriaga, Professor 

DATASOURCE: Semitool, Inc.



CONTACT:  Paul Siblerud, Vice President of Semitool Inc.,

[phone], ; or Geoff High of Pfeiffer High

Investor Relations, Inc., [phone], , for Semitool,

Inc.

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