Infineon Offers Ultra-Low Cost Dual SIM Integrated on a Single Platform; Next Generation of Monolithically Integrated Mobile Pho

  Today at the GSM Asia,
Infineon Technologies AG (FRANKFURT: IFX) (NYSE: IFX) introduced its latest
chips for Ultra-Low Cost mobile phones, optimizing the system performance
by factor five and also again reducing the bill-of-material (BOM) by almost
10 percent compared to currently available Infineon platform solutions.

Infineon's single-chip solution, the X-GOLD(TM)102, enables handset manufacturers to differentiate in the market by providing the lowest cost solutions based on technologies already available in high volume production. The chip will be provided as part of a platform solution, XMM(TM)1020, which encompasses a comprehensive suite of development tools and a support package to customers for shortest time-to-market. This enables customers to bring mobile phones to the market within a time frame of only five months compared to the industry's usual 10 - 12 months. This pre-tested platform delivers best-in-class RF performance, highest voice quality, well-proven protocol stack, smallest form factor (8mm x 8mm) as well as smallest bill-of-material, thereby creating highest customer value and differentiation in the market.

The X-GOLD102 single chip includes the baseband processor, the radio frequency (RF) transceiver, RAM memory and the entire power management unit for the mobile phone. It supports MP3 Audio (Basic Multimedia Phone), colour display, FM Radio interface, USB charger and is based on 130nm technology (CMOS SoC) for enhanced monolithic integration. Additionally the XMM1020 platform can be realized in a 4-layer PCB and low via count, in a modem area of less than 5 square centimetres and a component count of less than 50 devices.

Dual-SIM XMM(TM)1028

Infineon today also announced its new Ultra-Low Cost Dual-SIM platform. The XMM1028, based on the X-GOLD(TM)102DS, is a cost optimized single baseband solution for Dual-SIM platforms. Negating the need for either a second modem on the platform or complex mechanical switching, the XMM1028 provides a fully capable Dual-SIM solution based on a single baseband device.

The Infineon XMM1028 reference platform comprises one single-chip that integrates baseband, power management, RF and two SIM interfaces. This allows the user to benefit from the offerings of two network operators at the same time, without needing to switch the SIM-card. It offers voice call and SMS for SIM and features unique applications for dual SIM such as Phonebook or Call log. It furthermore allows automatic switching between operators.

The XMM1028 platform also needs less than 50 components (Modem) in a PCB mounted area of less than 6 square centimetres and furthermore offers a clean migration path for developers familiar with the XMM1010 platform with fast time-to-market and industry lowest system BOM, which enables manufacturers to offer best possible cost effectiveness in the Dual-SIM segment.

Availability of XMM(TM)1020 and XMM(TM)1028

Volume production of the XMM1020 and the XMM1028 has already started.

You can find further information on Infineon's products for mobile communications at: www.Infineon.com/Baseband_2G

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX).

Further information is available at www.infineon.com.

This news release is available online at www.infineon.com/press/

Media Relations Technology: Worldwide Headquarters Christoph von Schierstaedt [phone] [e-mail] U.S.A. Mitch Ahiers [phone] [e-mail]