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Georgia Tech to Provide UXPi-based Compliance Testing
DALLAS, Feb. 20 /PRNewswire/ -- The Unified 10Gbps Physical-Layer Initiative
(UXPi) today announced that Georgia Institute of Technology (Georgia Tech) has
joined the alliance to proliferate a common 10Gbps physical layer cross-market
standard to simplify and accelerate the implementation of next-generation 10Gbps
systems. A Georgia Tech research center, the Georgia Electronic Design Center
(GEDC), will provide UXPi-based compliance testing for the characterization of
multi-gigabit elements for serial communications.
Dr. Joy Laskar and Joseph M. Pettit, Professor of Electronics and director of
the GEDC, will be leading Georgia Tech's UXPi research efforts. "Getting
neighboring chips, boards and computers to interconnect and communicate without
bottlenecks is a key challenge to ubiquitous computing and communications," says
GEDC Director Laskar. "Georgia Tech's role in this alliance is to expand the
industry's understanding of the next generation 10Gbps physical layer, and we'll
do that, in part, by leveraging a state-of- the-art testbed with an advanced
integration platform."
"UXPi is excited to start this strategic relationship with GEDC. This will
provide a focal point for developing and providing testing methodology for
verifying performance to UXPi-aligned standards," says Ed Suder from Texas
Instruments, and Vice Chairman of UXPi.
Interest has been growing in UXPi since five companies launched the effort in
September 2002. The industry trend toward serial connectivity will reduce
system costs, simplify system design and provide scalability to meet emerging
bandwidth requirements. A program of the IEEE Industry Standards and Technology
Organization (IEEE - ISTO), UXPi is presently comprised of the following
companies and organizations:
Acuid Corporation Ltd.
Agilent Technologies
Applied Micro Circuits Corporation
Altera Corporation
ERNI Group
Georgia Institute of Technology
Infineon Technologies AG
International Business Machines Corporation
Northrup Grumman Interconnect Technology
Northrup Grumman Winchester Electronics
Quellan, Inc.
Tektronix
Teradyne, Inc.
Texas Instruments Incorporated
Xilinx, Inc.
UXPi's successes will complement and contribute to existing and upcoming
standardization efforts by multiple industry bodies; a broad representation of
industries among member companies will multiply the reach of UXPi efforts. UXPi
encourages any company with an interestin this technology to apply for
membership. Additional information is available at http://www.uxpi.org/ .
UXPi is organized as a program under the IEEE-ISTO, which provides a legal and
administrative platform on which UXPi operations can progress. UXPi plans to
work with numerous contributing and adopting companies to develop, refine and
make the specifications available. UXPi founding members include Applied Micro
Circuits Corporation (NASDAQ:AMCC), International Business Machines Corp.
(NYSE:IBM), Infineon AG (NYSE:IFX), Texas Instruments Incorporated (NYSE:TXN)
and Xilinx, Inc., (NASDAQ:XLNX). Additional information about UXPi membership,
activities and progress is available at http://www.uxpi.org/ .
The Georgia Institute of Technology is one of the nation's top research
universities, distinguished by its commitment to improving the human condition
through advanced science and technology. The Georgia Electronic Design Center,
a multi-disciplinary center at Georgia Tech, supports world-class research,
active and solution-oriented industry collaboration, intellectual property
generation and revenue generating commercialization efforts. Additional
information about Georgia Tech and GEDC is available at http://www.gatech.edu/
and http://www.gedcenter.org/ .
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DATASOURCE: Texas Instruments Incorporated
CONTACT: Jeff Smith of Texas Instruments Incorporated, +1-214-480-2426,
or ; or Heather Mills, +1-972-308-9131, or
, for Texas Instruments Incorporated. Please do not
publish these numbers or email addresses.
Web site: http://www.ti.com/
http://www.uxpi.org/
http://www.gatech.edu/
http://www.gedcenter.org/