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FSLB Freescale Semiconductor, Inc. (Class B)

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Share Name Share Symbol Market Type
Freescale Semiconductor, Inc. (Class B) NYSE:FSLB NYSE Common Stock
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Freescale Accelerates Automotive Innovation with Industry's Largest Embedded Flash Array

05/09/2006 1:01pm

Business Wire


Freescale (NYSE:FSLB)
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MPC5566 Microcontroller Built on Power Architecture(TM) Technology Integrates 3MB of Flash Memory for Sophisticated Powertrain Applications Freescale Semiconductor (NYSE:FSL) (NYSE:FSL.B), the leading provider of semiconductors to the automotive market, has achieved a milestone in microcontroller (MCU) technology to help fuel innovation in next-generation powertrain designs and other automotive control applications. The company's flagship MPC55xx automotive controller family built on Power Architecture(TM) technology now includes the MPC5566 -- the first 32-bit MCU to integrate 3MB of flash memory. The MPC5566 microcontroller features the largest embedded flash memory on an MCU in the industry today. By addressing the growing need for more embedded memory in automotive applications, the MPC5566 enables developers to design more advanced powertrain engine control systems that increase fuel efficiency and reduce harmful exhaust emissions. Large on-chip flash arrays provide application developers with a high-performance solution to support more sophisticated, memory-intensive engine control functionality. "Powertrain applications are the harshest of automotive electronic environments," said Mark Fitzgerald, an automotive electronics analyst at Strategy Analytics. "Semiconductor suppliers who can deliver reliable, high-performance microcontrollers that meet the demanding performance and efficiency requirements of leading automotive electronics manufacturers will be well positioned to succeed in the powertrain market." The MPC5566 controller is Freescale's seventh device in the MPC55xx family. The family is designed to provide significant performance gains over today's controller solutions, while helping to ensure a smooth migration path to higher-performance applications. Members of this scalable family of powertrain controllers are pin- and code-compatible, enabling reuse of code across multiple applications. "Freescale is the first to offer large flash arrays qualified for automotive temperatures, and we've now delivered the industry's first 3-MB device," said Mike McCourt, vice president and general manager of Freescale's microcontroller division. "Our leadership in automotive and embedded flash technology is evident throughout our powertrain controller portfolio. We continue to enhance our Power Architecture platforms to give the automotive industry the technology it needs to create next-generation powertrain, safety and telematics designs." The MPC55xx family is based on the power-efficient e200 core, built on Power Architecture technology -- fast becoming the industry-standard architecture for powertrain applications. In February 2006, ST Microelectronics and Freescale announced a collaboration agreement that outlines joint design of 32-bit automotive MCUs based on Power Architecture technology, including future 90-nm products with dual-source options available for these devices. Additionally, General Motors announced in 2004 that it will use the MPC55xx family in future GM powertrain engine control systems around the world. As the No. 1 supplier of microcontrollers to the automotive industry, Freescale continues to win powertrain designs and accolades. At the 2006 International Engine of the Year Awards, Freescale microcontrollers powered eight of the 12 winning engines. MPC55xx family features -- e200 core based on Power Architecture technology -- Variable length encoding (VLE) capability designed to help reduce code footprint by up to 30 percent for improved code density and reduced memory requirements -- Up to 32k cache depending on specific device -- Single-instruction/multiple data (SIMD) module for digital signal processor (DSP) and floating point operations, enhancing autocoding and functional integration of features such as knock detection -- Up to 3MB of embedded flash memory with Error Correction Coding (ECC) and Read-While-Write (RWW) capability -- Up to 128 KB on-chip static RAM (SRAM) with ECC -- Up to 88 timed I/O channels for complex timer functions, such as spark ignition and crank angle measurement (up to two eTPUs and one eMIOS) -- Communication interfaces: up to 5x FlexCAN; up to 2x eSCI; up to 4x DSPI -- 40-channel dual ADC with 5-volt conversion range -- FlexRay(TM) controller available on MPC5567 -- Ethernet controller available on MPC5553, MPC5566 and MPC5567 -- FM-PLL; up to 64-channel DMA controller; up to 401 source interrupt controller; Nexus IEEE-ISTO 5001-2003 Class 3+; 5/3.3V I/O, 5V ADC -- Available in 208MAPBGA, 324PBGA, 416PBGA (specific package implementation varies by device) MPC5566 availability The MPC5566 is available now in sample quantities. The MPC5566EVB evaluation board also is available now in sample quantities. For more product information, visit http://www.freescale.com/files/pr/mpc5566.html. About Freescale Semiconductor Freescale Semiconductor, Inc. (NYSE:FSL) (NYSE:FSL.B) is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. Freescale became a publicly traded company in July 2004. The company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale, a member of the S&P 500(R), is one of the world's largest semiconductor companies with 2005 sales of $5.8 billion (USD). www.freescale.com. -0- *T Reader Inquiry Response: Freescale Semiconductor P.O. Box 17927 Denver, CO 80217 USA *T Freescale(TM) and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. All other product or service names are the property of their respective owners. (C) Freescale Semiconductor, Inc. 2006.

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