Verigy to Showcase New Products and Present Papers on Latest Test Technologies at SEMICON West 2010

Verigy (NASDAQ:VRGY), a premier semiconductor test company, will showcase its newest products, present two technical papers and take part in an executive summit panel at the SEMICON West trade show, July 13-15 at the Moscone Convention Center in San Francisco.

In booth #5847 in North Hall, Verigy’s V93000 system with Direct-Probe™ RF capability will be shown for the first time. Designed to address the global semiconductor market’s rapid shift to wafer-level chip scale packages (WLCSP), the Direct-Probe RF capability eliminates the mechanical interface between the wafer and tester and reduces the cost of test for high-pin-count radio-frequency (RF), digital and mixed-signal devices. This new feature minimizes the correlation effort between wafer probing and final test, reduces the time between IC development and production, and enables high multi-site interfaces by simultaneously testing up to 32 sites.

Also on display will be Verigy’s low-cost SOC test system with new mixed-signal testing capabilities. Designed for high-volume testing of cost-sensitive ICs at both wafer sort and final test, the versatile V101 system now offers an ultra-low-noise floor to eliminate unwanted signals, which significantly improves accuracy and yield in testing mixed-signal ICs.

Verigy also will highlight its range of productivity-enabling products including its scalable V6000 FT system that delivers low cost-of-test, high parallelism and high yields in final testing of both Flash and DRAM devices; the V93000 HSM series, built on a scalable, multi-generation test platform that fulfills the performance, functionality and economical requirements for testing all available high-speed memory technologies; and Verigy’s unique Yield Learning Solution for automated on-tester diagnosis of failures that reduces the time and number of wafers needed to achieve entitlement yield.

Additionally, Verigy will showcase Touchdown Technologies’ scalable, MEMS-based probe cards for single-touchdown testing of wafers up to 300 mm. These advanced probe cards use patented ACCU-TORQ™ torsional probes to achieve higher probe counts, increased probe density and superior mechanical performance compared to alternative cantilever and dual-cantilever probes.

Supplementing the company’s product displays, Verigy technologists will present papers at two SEMICON West technical sessions, both taking place at the TechSITEs stage in the North Hall of the Moscone Convention Center. In the session on Test Challenges, Adam Smith, wireless center of expertise manager, will give his presentation on “Test Considerations for Mobile Wireless Wafer-Level Chip Scale Package (WLCSP) Applications” on Tuesday morning, July 13, from 11:30 a.m. to 11:50 a.m. On Wednesday afternoon, July 14, Jacob Orbon, director of yield products for DfX Solutions, will give his presentation on “Accelerating Yield Ramps with On-Tester Scan Diagnosis” from 12:10 p.m. to 12:30 p.m. during the session on Test Solutions. Both papers’ abstracts are posted on SEMI’s online show-planning tool called networkNow!

In addition, Verigy’s chairman and CEO Keith Barnes will participate in the Executive Summit Panel from 1:30 p.m. to 3 p.m. on Tuesday, July 13, on the keynote stage in the Esplanade Hall, Moscone South. Barnes will be joined in this panel discussion by senior executives from Lam Research, GLOBALFOUNDRIES, Applied Materials and KLA-Tencor.

About Verigy

Verigy provides advanced semiconductor test systems and solutions used by leading companies worldwide in design validation, characterization, and high-volume manufacturing test. Verigy offers scalable platforms for a wide range of system-on-chip (SOC) test solutions, and memory test solutions for Flash, DRAM including high-speed memories, as well as multi-chip packages (MCP). Verigy also provides advanced analysis tools that accelerate design debug and yield ramp processes. Additional information about Verigy can be found at www.verigy.com.

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