Trikon (NASDAQ:TRKN)
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Trikon Takes Risk Out of IC Production for Mainstream Silicon
Applications with New Omega i2L(R) Dry-Etch System
Perfect Fit for China Market Says Company CEO Dr. John MacNeil: Allows
Chipmakers Quick Ramp Up to Profitable Production
NEWPORT, Wales, March 17 /PRNewswire-FirstCall/ -- Trikon Technologies, Inc.
(NASDAQ:TRKN) today released details about its new Omega i2L(R) dry-etch
system. The company reports that its new platform will open up new market
opportunities in mainstream silicon and power management applications, among
others because of its proven technology and ability to reduce risk and improve
profitability. Company CEO Dr. John MacNeil says that the new platform should
be a positive "fit" for the China market and that the company is already
receiving good feedback from its network in the Asia Pacific region.
The new i2L etch platform combines the company's inline cassette-to- cassette
handling subsystem from its proven 200 series tools with the robust Windows NT
control software and process modules from Trikon's proven fxP(TM) series
cluster tools. The combination of proven handling, proven process control
software and the array of process modules from its established cluster tools
will enable the company to take advantage of new market opportunities by
surpassing the performance of competing technology for "mainstream silicon"
applications. Trikon defines "mainstream silicon" as robust process technology
for proven technology nodes greater than 100-nm that can be ramped quickly to
profitable production.
According to CEO Dr. MacNeil, "IC Manufacturers installing or upgrading
mainstream fabs need low-cost, high-reliability process tools. By drawing on
Trikon's proven production capabilities, we have produced a significant tool
for mainstream silicon applications without the usual risks associated with
developing a new tool for semiconductor manufacturing. The Omega i2L is also
applicable to MEMS and wafer level packaging using our Deep Silicon etch
technology; BAW device production and III-V applications.
Among the multiple applications for the Omega i2L in mainstream fabs, this tool
is particularly applicable for China's current emphasis on putting new 150-mm
and 200-mm fabs in place," noted MacNeil. "The 200-mm tools going into China's
new fabs must provide the simplicity and cost effectiveness needed today to
ramp the country's semiconductor industry quickly. However, these tools must
also be adaptable and cannot limit process capability or migration to the next
technology node. This is exactly what the Omega i2L is designed to do."
"In addition, for power management devices, the Omega i2L will extend our
technology leadership for trench etch, a critical application that has a direct
impact on device performance. The system will support the interferometric
endpoint detection system which has been proven at customer sites to
significantly improve device yield and reduce scrap."
Available process modules on the i2L include plasma enhanced reactive ion etch
(PERIE), inductively coupled plasma (ICP) etch, magnetic zero resonant
induction (M0RI) etch, deep-silicon etch (DSi), gas phase etch (GPE), and
post-etch corrosion/resist strip or isotropic oxide etch (Isopod). The Omega
i2L can be configured with 1 or 2 of these process modules for wafers up to 200
mm. Trikon's proven dielectric chemical vapor deposition process technology
(i.e., low-temperature NH3-free deposition with controllable stress) is also
being adapted to the i2L platform and will be available later in 2005.
With the i2L platform, Trikon can now put its most advanced etch process
modules on its existing semi-manual tool (the Omega r4P), the new in-line tool,
Omega i2L, or its existing cluster tool (the Omega fxP): a series of tools all
based around a common, interchangeable set of process modules. "Because our
etch process modules can be applied identically across our three tool
platforms, these processes are easily transferable, and training, diagnostics
and service is simplified," said Dr. Dave Thomas, Trikon's marketing manager
for etch.
The Omega i2L can include a flat/notch finder and cool down and is adaptable to
50-mm to 200-mm multi-wafer types, including silicon, III-V's and other
materials such as sapphire and glass and can be installed through-wall or
standalone in a ballroom cleanroom. First shipments are scheduled for April
2005.
About Trikon Technologies
Trikon Technologies is a leading provider of wafer fabrication equipment and
services to the global semiconductor industry. Trikon develops and manufactures
advanced capital equipment for plasma etching and chemical and physical vapor
deposition (CVD and PVD) of thin films for use in the production of
semiconductor devices. These are key components in all electronic products,
such as telecommunication devices, consumer and industrial electronics and
computers. More information is available on the World Wide Web at:
http://www.trikon.com/ .
DATASOURCE: Trikon Technologies, Inc.
CONTACT: Stew Chalmers, +1-818-980-3762, for Trikon Technologies, Inc.
Web site: http://www.trikon.com/