Media Alert: Rambus to Demonstrate High-Performance IP Cores for Networking and Data Center at TSMC OIP Ecosystem Forum

Rambus Inc. (NASDAQ:RMBS):

What:

        
        
           
        
        
           
        
        
          TSMC Open Innovation Platform (OIP) Ecosystem Forum
        
      
      
        
           
        
      
      
        
          

Who:

Rambus Inc. (Nasdaq:RMBS)

Where:

        
        
        
        
        
        
          Booth 916
        
      
      
        
        
        
        
        
        
        
          Santa Clara Convention Center
        
      
      
        
        
        
        
        
        
        
          5001 Great America Parkway
        
      
      
        
        
        
        
        
        
        
          Halls C and D
        
      
      
        
        
        
        
        
        
        
          Santa Clara, Calif. 95054
        
      
      
        
           
        
      
      
        
          

When:

        
        
        
        
        
        
          Wednesday, Sept. 13, 2017
        
      
      
        
           
        
      
    
    

Rambus will be demonstrating its high-speed SerDes IP Cores at the TSMC Open Innovation Platform (OIP) Ecosystem forum this week in Santa Clara, Calif.

Additional details

Rambus Multi-protocol SerDes PHY

• The demonstration will showcase the Rambus Multi-protocol SerDes PHY, a state-of-the-art serial link subsystem that delivers enterprise-class performance across challenging signaling environments typically found in networking and server systems. Specifically, the signaling demonstration will feature the Rambus 28G multi-modal SerDes PHY at 28Gbps on TSMC 28nm. The solution spans a range of performance – from 1.25 to 28 Gbps – and features application-specific optimization through an efficient, scalable architecture.

Visit Rambus at Booth 916 to learn more.

About Rambus Memory and Interfaces Division

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com.

View source version on businesswire.com: http://www.businesswire.com/news/home/20170912005702/en/

SHIFT CommunicationsLeslie Clavin, [e-mail]