Interlink Electronics (NASDAQ:LINKE)
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Interlink Electronics Inc. (NASDAQ:LINKE), a world
leader in the development of intuitive interface solutions and
technologies, announced today that Electronic Design News (EDN),
published by Reed Business Information, has named Interlink
Electronics' MicroNav Ring technology to its annual Hot 100 Products
of the year. Interlink's MicroNav Ring is a proprietary interface
product that provides intuitive menu scrolling to enhance the
usability of handheld electronic devices. In naming MicroNav Ring to
their Hot 100 Products list, EDN's technical editors analyzed and
compared candidates from all of the products appearing in the pages of
EDN during 2005.
"Over the course of a year, EDN covers an incredible number of
products spread across the breadth of the electronics industry,"
states Editor in Chief, Maury Wright. "We choose the 100 that we think
will prove most significant and useful to the design engineer.
Communications and multimedia were two of the leading application
areas in our selections this year, as consumer electronics and
audio-visual products continue to be the strongest market drivers in
technology."
"The MicroNav Ring circular scrolling interface solution offers
unique advantages to consumers and to the designers of handheld
electronics products," adds Rod Vesling, Vice President of Sales and
Marketing, Interlink Electronics, Inc. "To the consumer, MicroNav Ring
provides an intuitive circular menu scrolling wheel that enables quick
access to device content and functions. To the design engineer, it
provides a robust user interface rugged enough for typical use in
outdoor environments. MicroNav Ring is also cost-effective and
versatile, supporting direct integration with the device host
processor and allowing the use of metallic actuators, EL and LED
lighting, and more. MicroNav Ring is a very low power consumption
technology."
MicroNav Ring is a member of Interlink Electronics' MicroNav
family of proprietary interface products. Utilizing the company's
patented Force Sensing Resister(R) (FSR) technology, MicroNav
interface solutions enable circular menu scrolling, 360 degree "mouse"
navigation and pressure switch sensing for handheld consumer
electronics including mobile phones, MP3 players, remote controls and
more. More information on Interlink's MicroNav family of products,
which includes the MicroNav Ring, MicroNav 360 degree, MicroNav Array,
MicroNav Strip and MicroNav Touchpad, is available at
http://www.micronavlink.com.
About EDN
EDN is published by Reed Business Information
(www.reedbusiness/us.com), the largest business-to-business publisher
in the U.S. and a member of the Reed Elsevier Group plc (NYSE: RUK and
ENL) - a world-leading publisher and information provider operating in
the science and medical, legal, education and business-to-business
industry sectors.
Known as the "Voice of the engineer," Waltham, MA-based EDN serves
the vital information needs of design engineers and engineering
managers worldwide. The EDN franchise includes EDN, EDN Europe, EDN
Asia, EDN Australia, EDN China, EDN Japan, and EDN.com. For more
information on EDN's Hot 100 Products award, see EDN's December 16,
2005 issue and at http://www.edn.com/051216cs
About Interlink Electronics, Inc.
Interlink Electronics, Inc. (NASDAQ:LINKE) is a world leader in
the development of intuitive interface technologies and solutions for
business and home applications. Creating today's interface standards,
our business communications, e-transactions, home entertainment and
specialty components businesses have established Interlink as the
comprehensive source for branded and OEM solutions. Selected customers
include Dell, HP/Compaq, InFocus, Microsoft, Mitsubishi, NEC, Sanyo,
Sharp, Sony and Toshiba.
Recognized worldwide for innovative interface technologies and
solutions, Interlink Electronics, Inc. serves an international
customer base from its corporate headquarters in Camarillo, California
and offices in Tokyo, Hong Kong and China. The Company currently holds
numerous patents on sensor technologies, e-signature technologies,
wireless communication protocols and product design properties. See
Interlink Electronics online at http://www.interlinkelectronics.com/
or in Japan at http://www.interlinkelec.co.jp/
All registrations and trademarks are properties of their
respective owners.
This document contains forward-looking statements that involve a
number of risks and uncertainties. The following are among the factors
that could cause actual results to differ materially from the
forward-looking statements: business conditions and growth in the
electronics industry and general economies, both domestic and
international; lower than expected customer orders; delays in receipt
of orders or cancellation of orders; competitive factors, including
increased competition, new product offerings by competitors and price
pressures; the availability of third party parts and supplies at
reasonable prices; changes in product mix; significant quarterly
performance fluctuations due to the receipt of a significant portion
of customer orders and product shipments in the last month of each
quarter; and product shipment interruptions due to manufacturing
problems. The forward-looking statements contained in this document
regarding industry and revenue trends, industry product and technology
acceptance, product mix and future business activities should be
considered in light of these factors.