BindKey Selects FTD Solutions as Southeast Asia Distributor

BindKey Selects FTD Solutions as Southeast Asia Distributor
Appointment Extends Global Services for Global IC Design Accounts 


SUNNYVALE, Calif., Nov. 9  /PRNewswire/ -- BindKey Technologies, a DuPont
Photomasks (NASDAQ:DPMI) company and leading provider of design for
manufacturing (DFM) solutions for nanometer IC design, today announced the
appointment of FTD Solutions ( http://www.ftdsolutions.com/ ) as its exclusive
distributor for Singapore, Malaysia and India.  FTD will distribute BindKey's
RapiDesignClean(TM) and RapiDRCFix(TM) DFM products.

FTD Solutions provides a full range of EDA sales and support functions,
customized training and consultancy. FTD Solutions is one of the largest
distributors of IC design solutions in the Asia Pacific region, with sales
offices in Singapore, Malaysia and India, where they also have a joint venture
with Toshiba for IC design.

FTD Solutions joins other leading BindKey distributors in Asia, including
Innotech in Japan, Davan Tech in Korea and Maojet in Taiwan.

"IC design is a global activity, with Singapore, Malaysia and India rapidly
increasing their share," said Jeff Menkes, BindKey vice president of worldwide
sales. "BindKey chose FTD Solutions because it is a top-notch distribution
company, and, as a design organization, it understands the complex requirements
of nanometer design and the importance of moving DFM further up in the design
cycle."

"As a leading EDA software distribution company for the last 10 years in
Southeast Asia and India, we have consistently worked with companies like
BindKey that understand the design issues engineers face and provide practical
automation solutions," said Effindi Ahmad, general manager of EDA distribution
for FTD Solutions. "With its very fast RapidDesignClean product and other DFM
products, BindKey enables correct-by-construction design even with the complex
design and manufacturing rule sets required in nanometer design. The best part
of the BindKey product line is it works with a customer's current design
environment without requiring replacement of toolsets or changes in
methodology."

BindKey DFM Solutions

By solving manufacturability requirements during the design process, BindKey is
addressing some of the toughest challenges in IC physical implementation. Chief
among these are increasing design complexity and manufacturing constraints.
With nanometer ICs, designers must assure that the physical design (layout) can
be manufactured with acceptable yield, account for the manufacturing process
impact on chip function and performance, and manage critical tradeoffs between
performance and yield.

BindKey is meeting these challenges with new solutions to implement complex
rules-driven requirements, verify manufacturability and optimize layout for
lithography, yield and performance. BindKey's DFM solutions include:

  -- RapiDesignClean, a rules-driven IC layout solution that enables
     engineers to produce DRC-clean layouts fast and manage application of
     recommended DFM rules. RapiDesignClean is the first tool of its kind to
     provide full support for the most advanced technologies (90nm and
     below) in real time. RapiDesignClean lets layout engineers see exactly
     which rules apply for each edit, provides immediate notification when
     rules are violated and automatically repairs many violations in real
     time. The product complements customers' existing layout and physical
     verification flows.
  -- RapiDRCFix is a rules-driven auto layout correction tool for repairing
     design rule violations and implementing recommended DFM rules for
     nanometer IC layout. RapiDRCFix can correct thousands of DRC violations
     in less than an hour and supports large-scale implementation of
     recommended DFM rules.

  About BindKey


BindKey is a leading supplier of semiconductor design for manufacturing (DFM)
software solutions. The company's electronic design automation (EDA) tools
produce design-rule-correct integrated circuit (IC) layouts, improving
chipmakers' productivity and time to market by solving manufacturing issues
during the physical design phase. BindKey is headquartered at 510 North
Pastoria Ave., Sunnyvale, Calif., and has direct sales and support offices in
Silicon Valley, Austin, Texas, Munich, Germany, and distributors throughout the
Pacific Rim. For more information, please call 866-RapidIC (866-727-4342) or
visit the company Web site at http://www.bindkey.com/. BindKey is a wholly
owned subsidiary of DuPont Photomasks, Inc.

NOTE:  RapiDesignClean and RapiDRCFix are trademarks of BindKey Technologies
Inc.  All other products are trademarks of their respective companies.

FORWARD-LOOKING STATEMENTS:  Certain statements contained in this document that
are not historical facts, are "forward looking statements," as that term is
defined in Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934, that involve a number of risks and
uncertainties. Such forward-looking statements may concern growth and future
operating results, forecasts, projections, pricing pressures, the global
economic climate, new products and product enhancements, the future importance
of EDA technology, the demand for products, competitive factors, research and
development activities and expenditures, strategic relationships with third
parties, and our strategy. Such forward-looking statements are based upon
management's current plans, expectations, estimates and assumptions and are
subject to a number of risks and uncertainties. Actual events or results may
differ materially from those described in this press release due to a number of
risks and uncertainties. Additional risk factors affecting our business may
include relationships with and dependence on the semiconductor industry,
fluctuations in quarterly and annual earnings, operating in a capital intensive
industry, significant fixed costs, rapid technological change, competition,
significant international operations, world-wide market volatility,
manufacturing risks, fluctuation of income tax rates, concentration of
customers, dependence on suppliers, dependence on management and technical
personnel, volatility of market prices, potential acquisitions or dispositions,
technology challenges in the manufacture of advanced photomasks, intellectual
property, and changes in governmental laws and regulations. Factors that could
cause or contribute to such differences include, but are not limited to, those
factors set forth above, certain of which are more fully discussed under the
caption "Risk Factors" in the Company's Annual Report on Form 10-K filed with
the Securities and Exchange Commission dated September 9, 2004 and the
Company's quarterly report on Form 10-Q dated November 5, 2004. The
forward-looking statements are made as of the release date hereof and we
disclaim any intention or obligation to update or revise any forward-looking
statements or to update the reasons why the actual results could differ
materially from those projected in the forward-looking statements, whether as a
result of new information, future events or otherwise. 

DATASOURCE: BindKey Technologies Inc.



CONTACT:  Rich Bruer of McClenahan Bruer, [phone], or

, for BindKey Technologies Inc.; or investors, Tom Blake of

BindKey Technologies Inc., [phone], or 



Web site:  http://www.ftdsolutions.com/ 

Web site:  http://www.bindkey.com/ 

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