ASAT Holdings to Present at Bank of America Credit Conference December 4, 2007

HONG KONG and MILPITAS, Calif., Nov. 26  /PRNewswire-FirstCall/ -- ASAT Holdings Limited (NASDAQ:ASTT) (the "Company" or "ASAT"), a global provider of semiconductor package design, assembly and test services, today announced ASAT management will participate in the Bank of America 2007 Credit Conference in Orlando, Fla., on Tuesday, December 4, 2007 at 7:30 a.m. ET.

  (Logo:  http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO)

  Event:               Bank of America 2007 Credit Conference
  Date:                Tuesday, December 4, 2007
  Presentation Time:   7:30 a.m. ET
  Location:            Royal Pacific Resort -- Orlando
  Webcast:             http://www.asat.com/


  About ASAT Holdings Limited


ASAT Holdings Limited is a global provider of semiconductor package design, assembly and test services.  With 18 years of experience, the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines.  ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip.  ASAT was the first company to develop moisture sensitive level one capability on standard leaded products.  Today the Company has operations in the United States, Asia and Europe.  For more information, visit http://www.asat.com/. 

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DATASOURCE: ASAT Holdings Limited



CONTACT:  Jim Fanucchi of Summit IR Group Inc., [phone],

, for ASAT Holdings Limited



Web site:  http://www.asat.com/ 

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