Ascent Solar to Exhibit at Intersolar 2010 in Munich Germany

Ascent Solar Technologies, Inc. (NASDAQ:ASTI), a manufacturer of state-of-the-art, flexible thin-film photovoltaic modules, announced that it will be exhibiting at booth number B6-380 during the upcoming Intersolar 2010 trade fair on June 9-11, 2010 in Munich, Germany. Intersolar 2010 is expected to attract up to 60,000 professional attendees with 50% from abroad. Ascent will have samples of its WaveSol modules on display including integrated products that demonstrate the unique capabilities of its technology.

Parties interested in additional information or to meet with the company at this event should contact Brian Blackman at 720-872-5107 or [e-mail].

About Ascent Solar Technologies:

Ascent Solar Technologies, Inc. is a developer of thin-film photovoltaic modules with substrate materials that can be more flexible and affordable than most traditional solar panels. Ascent Solar modules can be directly integrated into standard building materials, space applications, consumer electronics for portable power or configured as stand-alone modules for large scale terrestrial deployment. Ascent Solar is headquartered in Thornton, Colorado. For more information, go to www.AscentSolar.com.

Forward Looking Statements

Statements in this press release that are not statements of historical or current fact constitute "forward-looking statements." Such forward-looking statements involve known and unknown risks, uncertainties and other unknown factors that could cause the Company's actual operating results to be materially different from any historical results or from any future results expressed or implied by such forward-looking statements. In addition to statements that explicitly describe these risks and uncertainties, readers are urged to consider statements that contain terms such as "believes," "belief," "expects," "expect," "intends," "intend," "anticipate," "anticipates," "plans," "plan," to be uncertain and forward-looking. The forward-looking statements contained herein are also subject generally to other risks and uncertainties that are described from time to time in the Company's filings with the Securities and Exchange Commission.