Ansoft Releases ePhysics v2; New Release Provides Dynamic-Link Co-Simulation of Thermal and Stress Analysis With HFSS and Maxwe

Ansoft Corporation (NASDAQ:ANST) today announced the
immediate availability of ePhysics(TM) v2. This latest version
enhances ePhysics' 3D steady-state thermal, transient thermal and
linear stress analyses coupling to HFSS(TM) and Maxwell(R) 3D with
dynamic-link co-simulation. The new capability allows engineers to
simulate heating, stress and deformation consequences of high- and
low-frequency electromagnetic fields.
   ePhysics v2 responds to the market demand to have an integrated,
multi-disciplinary approach to electrical component design, essential
for devices operating under high power, faster data rates and reduced
physical size, where thermal and mechanical effects need to be
evaluated due to their influence on the overall performance.
   The ePhysics user interface, including design management
front-end, 3D modeler, parametric control, simulation set-up and
post-processing interfaces, have been migrated to the Ansoft desktop
concept shared by HFSS and Maxwell 3D. Engineers can easily account
for the thermal and mechanical quantities that significantly
contribute to a design's overall performance directly within the
familiar, easy-to-use, Ansoft environment.
   Coupling ePhysics with Maxwell 3D provides the cross-disciplinary
analysis required in the design of electromechanical devices. Typical
applications include the analysis of electric machines,
power-generation systems, transformers, microelectromechanical systems
(MEMS) and solenoids.
   "Now that ePhysics v2 can be coupled directly to Maxwell, we are
able to assess the thermal and stress behavior of magnetic components
very conveniently," said Richard Osman, PE, principal product
engineer, Siemens Energy & Automation Inc. "This advanced capability
from Ansoft has greatly improved our ability to validate and optimize
our designs before building hardware."
   HFSS with ePhysics is vital for applications such as high-speed
packages, antennas, monolithic microwave integrated circuits (MMICs),
high-power microwave devices, military and broadcast communications
and biological heating with radio frequency (RF) sources. These
analyses include high-power, temperature-induced stress and size
changes of design components.

   New features include:

   --  New Ansoft desktop interface

   --  Dynamic-link coupling with Maxwell 3D and HFSS, which includes
        automatic mapping of power loss and force densities integrated
        with adaptive meshing technology

   --  Multiple design couplings that may be "daisy chained" in the
        process of creating complex applications

   --  Maxwell Transient - Thermal Transient

   --  HFSS Transient Sequence - Thermal Transient

   --  Nonlinear thermal properties (conductivity vs. Temp)

   --  Anisotropic stress solution

   --  64-bit solvers available

   ePhysics is available immediately for PC and UNIX(R) platforms. To
learn more, visit www.ansoft.com/ephysics.

   Editors: To download three high-resolution ePhysics images and
captions, please go to
ftp://ftp.ansoft.com/techsup/download/web/primg/ephysics_v2.zip.

   About Ansoft

   Ansoft is a leading developer of high-performance electronic
design automation (EDA) software. Engineers use Ansoft software to
design state-of-the-art electronic products, such as cellular phones,
Internet-access devices, broadband networking components and systems,
integrated circuits (ICs), printed circuit boards (PCBs), automotive
electronic systems and power electronics. Ansoft markets its products
worldwide through its own direct sales force and has comprehensive
customer-support and training offices throughout North America, Asia
and Europe. For more information, please visit www.ansoft.com.