Ansoft (NASDAQ:ANST)
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Ansoft Corporation (NASDAQ:ANST) announces Turbo Package Analyzer™
(TPA) v5. This latest version of TPA introduces new automation, design
flow and simulation capability needed for the extraction of the
electrical characteristics of complex high-performance ball-grid array
(BGA) style packaging, including wirebond (WBBGA), flip-chip (FCBGA),
chip-scale packages (CSPs) and System in Packages (SiP).
TPA v5 increases the capacity of the solver to address larger-sized
packaging problems and introduces greater automation for generating
and/or modifying 3D package layouts. TPA v5 introduces a new user
interface that includes new 2D editing and 3D viewing capabilities,
unlimited undo/redo capability, powerful new editing and automation
features, such as geometry validation checking and support for VB
scripting.
Combined with AnsoftLinks™, a tool for
simplifying data import and export between EDA and CAD packages, TPA v5
generates resistance, inductance and capacitance (RLC) models directly
from popular package design tools. It accepts CAD data and fully
characterizes the entire package in three dimensions. Extracted
sub-circuits can be exported into Nexxim®,
the company’s high-performance circuit
simulation software, or existing SPICE tools (SPICE/IBIS format) for
subsequent transient analyses, such as crosstalk, overshoot and TDR.
TPA v5 highlights include:
-- AC RLC computation for 3D structures
-- Automated coupled full-package AC RLC extraction using
efficient surface triangulation algorithms
-- DC resistance computation for 3D structures
-- Automated net-by-net full-package DC resistance extraction
using a volumetric (tetrahedral) mesh
-- Ability to designate source and sink terminal assignment on any
given net
-- New 2D layout editor and 3D viewer
-- Create advanced wirebond or flip-chip designs from scratch or
modify/correct designs imported from third-party layout tools
-- System-in-Package (SiP) design with multiple wire bond
configurations including Trace-to-trace, Die-to-die and
Cascaded
-- User-defined wirebond profiles expanding shapes from
JEDEC 4- and 5-point to include arbitrary polylines
-- Complex solderball models capture true shape and subsequent
electrical performance of solderballs and flip-chip
solder-bumps
-- New layer stack-up editor
-- New via pad stack editor
-- VB scripting support
-- Validation check to verify setup, including detection of
self-intersecting polygons; disjoint nets; overlapping
(DC-shorted) nets, vias and bond wires; illegal connections
between bonding pads and bond wires
-- Microsoft Windows(R) XP Professional x64 support
Pricing and Availability:
TPA v5 is available for Microsoft Windows XP Professional, Windows XP
x64 Edition and Windows Server 2003. Contact your nearest Ansoft sales
office for pricing information.
To download a high-resolution TPA v5 image, please go to ftp://ftp.ansoft.com/techsup/download/web/primg/tpa_50.tif.
About Ansoft
Ansoft is a leading developer of high-performance electronic design
automation (EDA) software. Engineers use Ansoft software to design
state-of-the-art electronic products, such as cellular phones,
Internet-access devices, broadband networking components and systems,
integrated circuits (ICs), printed circuit boards (PCBs), automotive
electronic systems and power electronics. Ansoft markets its products
worldwide through its own direct sales force and has comprehensive
customer-support and training offices throughout North America, Asia and
Europe. For more information, please visit www.ansoft.com.