Aehr Test Systems to Announce First Quarter Fiscal 2019 Financial Results on September 27, 2018

Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it will report financial results for its first quarter of fiscal 2019 ended August 31, 2018 on Thursday, September 27, 2018 following the close of the market. The Company will host a conference call and webcast at 5:00 p.m. Eastern time to discuss the results.

What:	Aehr Test Systems first quarter fiscal 2019 financial results conference call.
When:	Thursday, September 27th at 5:00 p.m. Eastern Time (2:00 p.m. PT).
Dial in number:	To access the live call, dial 800-458-4121 (US and Canada) or [phone] (International) and give the participant passcode 6249614.
Webcast:	To access the live webcast, please visit the investor relations section at www.aehr.com.
Call Replay:	A phone replay of the call will be available approximately two hours following the end of the call through 8:00 p.m. ET on Thursday, October 4, 2018. To access the replay dial-in information, please click here.

About Aehr Test SystemsHeadquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS™ and FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.

Contacts:
Aehr Test Systems	Investor Relations Contact:
Ken Spink	Todd Kehrli or Jim Byers
Chief Financial Officer	MKR Group, Inc.
[phone] x309	[phone]
	[e-mail]