Increased Costs Across the Supply Chain Due to Packing Material and Involved Processes are the Biggest Concerns say Top F&B C...

        






Increased Costs Across the Supply Chain Due to Packing Material and Involved Processes are the Biggest Concerns say Top F&B Companies

GURGAON, India, January 11, 2013 /PRNewswire/ --

"The greatest concerns today in F&B packaging is managing the increasing cost challenges across the supply chain due to packing material and involved processes" says Bimal Lakhotia (National Head - Packaging Development and Commercialisation, Hindustan Coca-Cola Beverages).

He further adds "An effective collaboration between F&B manufacturer and service providers/vendors will definitely help in eliminating various 'non-value add cost elements' from the chain. The model is effectively followed by automobile major. Further same will also facilitate new advancements in technology, application of best practices for a bigger benefit."

Prof CS Purushothaman (Chair Professor and Director, SIES School of Packaging) says "The latest trends in flexibles and rigids would be in active and intelligent packaging with sustainability focus."

He continues "Some of them are in flexible edible films, life extending packs with imbedded nano materials, oxygen and ethylene oxide scavengers as packaging components. In rigids there may not be so much push as sustainability is the word of the day. Hence keeping the 3 Rs (Reduce, Reuse, Recycle) in mind, flexibles will be preferred."

Both Mr Lakhotia and Prof Purushothaman will be sharing their views at the InnoPack F&B 2013 conference taking place from 27-28February at the DoubleTree by Hilton, Gurgaon, India.

InnoPack F&B 2013 also has other eminent speakers on board including Prabuddha Dasgupta (Ex Group Leader Packaging Development-Foods, Hindustan Unilever), Sameer Mehendale (Associate Vice President Packaging Development, Mondelez), Barun Banerjee (Corporate Packaging Manager SAR, Nestle), Vaibhav Tandon (Vice President Packaging Development, Pepsico), Vince Voron (Associate Vice President and Head of Design, Coca-Cola), Ainain Shahidi (General Manager Worker and Corporate Head-Packaging Strategy, Sahara Q Shop) and BK Karna (Deputy Director and Campus Head, Indian Institute of Packaging Hyderabad) among other industry experts, all of whom are at the centre stage of development of innovative packaging solutions globally.

Issues being addressed at the conference cover the regulatory landscape, minimising migration in food, enhancing packaging shelf-life, cost reduction strategies and global innovations in flexibles and rigids.

Over 100 industry experts will be gathering including leading companies such as Pepsico, Kraft Foods, Nestle, Coca-Cola and Sahara. Corporate partners include USP Packaging Solutions, SMI Coated Products, Ishida India, Bosch India and Karomi Technology. For more information, visit http://www.innopack-food.com

About UBM India:

UBM India is a subsidiary of UBM plc, which is the second largest independent exhibition organiser in the world. It is the largest trade exhibition organiser in India, responsible for 26 exhibitions in different locations across the country. The company is also involved in the organisation of conference programmes throughout India and in the publications of trade journals and magazines. For further details please visit the UBM India website, http://www.ubmindia.in

Food Ingredients India (Fi India):

Launched in 2006, Fi India has been known as a driving force to India's processed food sector and has a fundamental role as facilitating the industry's only meeting place. Both regional and global food professionals use this opportunity to learn about the latest industry developments, meet new business prospects and launch new products to gain competitor advantage in the fastest growing food marketplace in the world.

By bringing the industry together, Fi India allows you to display your products to thousands of food professionals at once and conduct business in an efficient and effective manner.

Shwetha Prabhu, [phone], [e-mail]

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