DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers

SAN FRANCISCO, April 18, 2017 /PRNewswire/ -- DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces the recipients of its Best Paper Awards following a successful DesignCon 2017 in Santa Clara, CA, on January 19-21. The winners are recognized for their outstanding contribution to the diverse educational goals of DesignCon. To view the full list of winners, visit: http://ubm.io/2pvrEHk  

The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation. 

"Congratulations to all finalists and winners of this year's Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees," said Naomi Price, DesignCon Conference Content Director. "Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon."

Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:

Chip-Level Design
•	Characterizing and Selecting the VRM
	Steve Sandler, Picotest
Board/System-Level Design
•	FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter
	Yunhui Chu, Intel Corporation
	Alaeddin Aydiner, Intel Corporation
	Kai Xiao, Intel Corporation
	Beomtaek Lee, Intel Corporation
	Dan Oh, Samsung Electronics
	Oleg Mikulchenko, Intel Corporation
	Adam Norman, Intel Corporation Rob Friar, Intel Corporation
	Charles Phares, Intel Corporation
•	Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard
	Heidi Barnes, Keysight Technologies
	José Moreira, Advantest
	Manuel Walz, Advantest
•	RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology
	Masashi Shimanouchi, Intel Corporation
	Hsinho Wu, Intel Corporation
	Mike Peng Li, Intel Corporation
Serial Link Design
•	Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE
	Jan B. Preibisch, Technische Universität Hamburg-Harburg
	Torsten Reuschel, Technische Universität Hamburg-Harburg
	Katharina Scharff, Technische Universität Hamburg-Harburg
	Jayaprakash Balachandran, Cisco Systems Inc.
	Bidyut Sen, Cisco Systems Inc.
	Christian Schuster, Technische Universität Hamburg-Harburg
•	Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links
	Yuhan Yao, Oracle Corporation
	Xun Zhang, Oracle Corporation
	Dawei Huang, Oracle Corporation
	Jianghui Su, Oracle Corporation
	Muthukumar Vairavan, Oracle Corporation
	Chai Palusa, Oracle Corporation
•	PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link
	Mohammad S. Mobin, Broadcom Ltd
	Haitao Xia, Broadcom Ltd
	Aravind Nayak, Broadcom Ltd
	Gene Saghi, Broadcom Ltd
	Christopher Abel, Broadcom Ltd
	Lane Smith, Broadcom Ltd
	Jun Yao, Broadcom Ltd
Power & RF Design
•	Cost-effective PCB Material Characterization for High-volume Production Monitoring
	Yongjin Choi, Hewlett-Packard Enterprise
	Christopher Cheng, Hewlett-Packard Enterprise
	Yasin Damgaci, Hewlett-Packard Enterprise
	Nagaraj Godishala, Hewlett-Packard Enterprise
	Yuriy Shlepnev, Simberian
•	Overview and Comparison of Power Converter Stability Metrics
	Joseph 'Abe' Hartman, Oracle
	Alejandro 'Alex' Miranda, Oracle
	Kavitha Narayandass, Oracle
	Alexander Nosovitski, Oracle
	Istvan Novak, Oracle
•	RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices
	Antonio Ciccomancini Scogna, Samsung Electronics Mobile Division, HE Group
	Hwanwoo Shim, Samsung Electronics Mobile Division, HE Group
	Jiheon Yu, Samsung Electronics Mobile Division, HE Group
	Chang-Yong Oh, Samsung Electronics Mobile Division, HE Group
	Seyoon Cheon, Samsung Electronics Mobile Division, HE Group
	NamSeok Oh, Samsung Electronics Mobile Division, HE Group
	Dong Sub Kim, Samsung Electronics Mobile Division, HE Group

To view the entire list of recipients, including individual researchers, please visit: http://designcon.com/santaclara/conference/paper-award-winners 

DesignCon 2018 Call for Papers
DesignCon returns to the Santa Clara Convention Center on January 30- February 1, 2018. Call for Papers will begin in mid-May with submissions due by the mid-July, 2017 deadline. To stay updated on next year's event, visit: designcon.com

Follow DesignCon online: facebook.com/DesignCon, @UBMDesignCon, flickr.com/photos/designcon

About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

About UBM Americas 
UBM Americas, a part of UBM plc, is the largest business-to-business events and trade show organizer in the U.S. Through a range of aligned interactive physical and digital environments, UBM Americas increases business effectiveness for both customers and audiences by cultivating meaningful experiences, knowledge and connections. UBM Americas has offices spanning North and South America, and serves a variety of specialist industries with dedicated events and marketing services covering everything from fashion, tech and life sciences to advanced manufacturing, cruise shipping, specialty chemicals, powersports and automotive, concrete, hospitality, cargo transportation and more. For more information, visit: www.ubmamericas.com. 

 

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